Systems and methods for trimming dental aligners
US-2024058100-A1 · Feb 22, 2024 · US
US8990762B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8990762-B2 |
| Application number | US-201414291285-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 30, 2014 |
| Priority date | Jul 12, 2012 |
| Publication date | Mar 24, 2015 |
| Grant date | Mar 24, 2015 |
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A semiconductor device design method performed by at least one processor comprises extracting, using a resistance and capacitance (RC) extraction tool, at least one first parasitic capacitance among electrical components inside one or more regions of a plurality of regions in a layout of a semiconductor device. The method also comprises extracting, using the RC extraction tool, at least one second parasitic capacitance among electrical components outside the regions of the plurality of regions. The method further comprises combining, using a netlist generator tool, the extracted first and second parasitic capacitances into a netlist representing the layout. The RC extraction tool is configured to extract the first parasitic capacitances inside at least one region of the plurality of regions using a methodology more accurate than that for extracting the second parasitic capacitances.
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What is claimed is: 1. A semiconductor device design method performed by at least one processor, said method comprising: extracting, using a resistance and capacitance (RC) extraction tool, a first parasitic capacitance, the first parasitic capacitance being between a first set of electrical components, the first set of electrical components being positioned inside a defined region within a layout of a semiconductor device, the first parasitic capacitance being extracted by the RC…
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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