Integrated circuit system providing enhanced communications between integrated circuit dies and related methods

US8990540B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8990540-B2
Application numberUS-201213560414-A
CountryUS
Kind codeB2
Filing dateJul 27, 2012
Priority dateJul 28, 2011
Publication dateMar 24, 2015
Grant dateMar 24, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method may include receiving, at a first integrated circuit die, a memory transaction having an address from a second integrated circuit die. The method may further include determining, at the first integrated circuit die and based on the address, if the transaction is for the first integrated circuit die and, if so, translating the address. If transaction is for a third integrated circuit die, the transaction may be transmitted, without modification to the address, to the third integrated circuit die. The translation may be based upon a first table with each entry including a first address and a second translated address corresponding to the first address, and a second table with each entry including a first address and an indication if the transaction is to be forwarded without modification to the address.

First claim

Opening claim text (preview).

What is claimed is: 1. An arrangement comprising: a first interface configured to receive a memory transaction having an address from a second arrangement; a second interface; an address translator configured to determine, based on said address, if said transaction is for said first arrangement and if so to translate said address or if said transaction is for a third arrangement to forward said transaction without modification to said address to said second interface, said sec…

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What does patent US8990540B2 cover?
A method may include receiving, at a first integrated circuit die, a memory transaction having an address from a second integrated circuit die. The method may further include determining, at the first integrated circuit die and based on the address, if the transaction is for the first integrated circuit die and, if so, translating the address. If transaction is for a third integrated circuit di…
Who is the assignee on this patent?
Jones Andrew Michael, Ryan Stuart, St Microelectronics Res & Dev
What technology area does this patent fall under?
Primary CPC classification G06F13/385. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).