Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test

Patent metadata

Field	Value
Publication number	US-8987014-B2
Application number	US-46709409-A
Country	US
Kind code	B2
Filing date	May 15, 2009
Priority date	May 21, 2008
Publication date	Mar 24, 2015
Grant date	Mar 24, 2015

Abstract

A semiconductor wafer contains a plurality of semiconductor die. A plurality of interconnect bump pads is formed over the semiconductor die. A plurality of sacrificial bump pads is formed in proximity to and diagonally offset with respect to the interconnect bump pads. The sacrificial bump pads have a different diameter than the interconnect bump pads. A conductive link is formed between each interconnect bump pad and proximate sacrificial bump pad. The sacrificial bump pads, interconnect bump pads, and conductive link are formed concurrently or during bump formation. The wafer is electrically tested by contacting the sacrificial bump pads. The electrical test identifies known good die and defective die. The sacrificial bump pads and a portion of the conductive link are removed after wafer probing. Bumps are formed over the interconnect bump pads. The semiconductor wafer can be sold or transferred to a third party after wafer probing without bumps.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a semiconductor wafer including a plurality of semiconductor die;
forming a plurality of interconnect bump pads over the semiconductor die;
forming a plurality of sacrificial bump pads in proximity to the interconnect bump pads and over an active surface of the semiconductor die;
forming a conductive link between each interconnect bump pad and proximate sacrificial bump pad;
wafer probing…

Assignees

• Pendse Rajendra D
• Stats Chippac Ltd

Inventors

• Pendse Rajendra D

Classifications

• H10W74/117

  Electricity · mapped topic

• H10W72/29

  Electricity · mapped topic

• H10P74/273 Primary

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic