Modified liquid epoxy resin as well as epoxy resin composition using the same and cured product thereof

US8981160B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8981160-B2
Application numberUS-37783107-A
CountryUS
Kind codeB2
Filing dateAug 14, 2007
Priority dateAug 17, 2006
Publication dateMar 17, 2015
Grant dateMar 17, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by area in view of the fluidity. Moreover, the mixture of bisphenol and the phenol aralkyl resin is preferable to have a ratio of the phenol aralkyl resin of 10-70% by mass.

First claim

Opening claim text (preview).

The invention claimed is: 1. A modified liquid epoxy resin, which is obtained by mixing a bisphenol and a biphenyl-type phenol aralkyl resin in a mixing ratio and reacting the resulting mixture with an epihalohydrin, wherein the mixing ratio of the bisphenol (A) and the biphenyl-type phenol aralkyl resin (B) in a mass ratio expressed as A/B as converted to epoxy resin is between 4/6 and 8/2, wherein the bisphenol (A) is bisphenol F having a bifunctional form purity of not less than 95% by area as detected by a gel permeation chromatography at UV 254 nm, wherein the bisphenol F includes a compound represented by the following formula (1): wherein n represents a repeating number and is an integer of not less than 1, and wherein the content of the compound of formula (1) is not more than 2% by area. 2. An epoxy resin composition comprising a modified liquid epoxy resin as claimed in claim 1 and a curing agent. 3. A cured product of an epoxy resin composition, which is formed by curing an epoxy resin composition as claimed in claim 2 .

Assignees

Inventors

Classifications

  • C08G59/063Primary

    with epihalohydrins · CPC title

  • Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

  • of polyhydric phenols · CPC title

  • C08G59/04Primary

    of polyhydroxy compounds with epihalohydrins or precursors thereof · CPC title

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What does patent US8981160B2 cover?
This invention provides a modified liquid epoxy resin having a low viscosity and a high performance, which is obtained by reacting a mixture of a bisphenol and a phenol aralkyl resin with an epiholohydrin. The bisphenol is preferable to be bisphenol F and is further preferable to have a bifunctional form purity as detected by gel permeation chromatography at UV 254 nm of not less than 95% by ar…
Who is the assignee on this patent?
Nakanishi Masataka, Oshimi Katsuhiko, Sunaga Takao, and 1 more
What technology area does this patent fall under?
Primary CPC classification C08G59/063. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).