Method for determining a position of an object in a beam apparatus, computer program product and beam apparatus for carrying out the method
US-2024258068-A1 · Aug 1, 2024 · US
Wafer inspection system
US8976348B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8976348-B2 |
| Application number | US-201414224428-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 25, 2014 |
| Priority date | Jun 4, 2010 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
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Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.
First claim
Opening claim text (preview).
What is claimed is: 1. A wafer inspection system comprising a wafer inspection device that comprises: an inspection unit that detects a sample center location on a wafer, and inspects the wafer with respect to a compensated center location according to an inspection control signal, and generates defect data based on the compensated center location; and an inspection control unit that generates the inspection control signal, wherein the inspection control signal compensates the s…
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Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
- G01N23/2251Primary
Physics · mapped topic
- G06T7/001Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US8976348B2 cover?
- Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd, Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G01N23/2251. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).