Photoresist stripping and cleaning composition, method of its preparation and its use
US-9223221-B2 · Dec 29, 2015 · US
Method of removing negative acting photoresists
US8975008B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975008-B2 |
| Application number | US-201313898802-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 21, 2013 |
| Priority date | May 24, 2012 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
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Polymerized negative acting photoresists are removed from substrates at relatively low temperatures and fast stripping times using aqueous based alkaline solutions.
First claim
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What is claimed is: 1. A method comprising: a) providing a substrate comprising polymerized negative acting photoresist; and b) contacting the substrate comprising the polymerized negative acting photoresist with an aqueous alkaline solution consisting of ammonium hydroxide at a concentration of 0.1 g/L to 15 g/l, one or more alkanolamines at a concentration of 0.5 g/l to 100 g/L, one or more quaternary ammonium hydroxides and one or more anticorrosion agents and water to remove…
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Frequently asked questions
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- What does patent US8975008B2 cover?
- Polymerized negative acting photoresists are removed from substrates at relatively low temperatures and fast stripping times using aqueous based alkaline solutions.
- Who is the assignee on this patent?
- Rohm & Haas Elect Mat
- What technology area does this patent fall under?
- Primary CPC classification G03F7/425. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).