Guard ring design for maintaining signal integrity

Patent metadata

Field	Value
Publication number	US-8970001-B2
Application number	US-201213729389-A
Country	US
Kind code	B2
Filing date	Dec 28, 2012
Priority date	Dec 28, 2012
Publication date	Mar 3, 2015
Grant date	Mar 3, 2015

Abstract

A structure includes a metal feature, and a passivation layer having a portion overlapping the metal feature. The passivation layer includes a non-low-k dielectric material. A polymer layer is over the passivation layer. A Post-Passivation Interconnect (PPI) extends into the polymer layer to electrically couple to the metal feature. A guard ring includes a second PPI, wherein the guard ring is electrically grounded. The second PPI substantially encircles the first PPI.

First claim

What is claimed is:

1. A structure comprising:
a first metal feature;
a passivation layer comprising a portion overlapping the first metal feature, wherein the passivation layer comprises a non-low-k dielectric material;
a first polymer layer over the passivation layer;
a first Post-Passivation Interconnect (PPI) extending into the first polymer layer to electrically couple to the first metal feature;
a guard ring comprising a second PPI, wherein the guard ring is electric…

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Lii Mirng-Ji
• Tsai Hao-Yi
• Chen Hsien-Wei
• Kuo Hung-Yi

Classifications

• H10W72/0198

  Electricity · mapped topic

• H10W72/952

  Electricity · mapped topic

• H10W72/9415

  Electricity · mapped topic

• H10W72/29

  Electricity · mapped topic

• H10W72/01938

  Electricity · mapped topic