MEMS devices

Patent metadata

Field	Value
Publication number	US-8969979-B2
Application number	US-201314132328-A
Country	US
Kind code	B2
Filing date	Dec 18, 2013
Priority date	Dec 2, 2011
Publication date	Mar 3, 2015
Grant date	Mar 3, 2015

Abstract

A method includes forming a Micro-Electro-Mechanical System (MEMS) device on a front surface of a substrate. After the step of forming the MEMS device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate. The through-opening is filled with a dielectric material, which insulates a first portion of the substrate from a second portion of the substrate. An electrical connection is formed on the backside of the substrate. The electrical connection is electrically coupled to the MEMS device through the first portion of the substrate.

First claim

What is claimed is:

1. A device comprising:
a substrate;
a Micro-Electro-Mechanical System (MEMS) device on a front surface of the substrate;
a dielectric material penetrating through the substrate, wherein the dielectric material forms a ring, wherein an entirety of the ring is formed of a homogeneous material, and wherein the ring separates the substrate into:
a first portion encircled by the ring; and
a second portion outside of the ring, wherein the first portion is ele…

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Lee Te-Hao
• Hsieh Yuan-Chih

Classifications

• H04R31/00

  Electricity · mapped topic

• B81B2201/0235

  Operations & Transport · mapped topic

• H04R19/005

  Electricity · mapped topic

• H04R19/04

  Electricity · mapped topic

• B81B3/0021 Primary

  Operations & Transport · mapped topic