Methods of forming a finfet semiconductor device with undoped fins

US8969932B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8969932-B2
Application numberUS-201213711779-A
CountryUS
Kind codeB2
Filing dateDec 12, 2012
Priority dateDec 12, 2012
Publication dateMar 3, 2015
Grant dateMar 3, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

One method disclosed herein includes, prior to forming an isolation region in a semiconducting substrate for the device, forming a doped well region and a doped punch-stop region in the substrate, introducing a dopant material that is adapted to retard diffusion of boron or phosphorous into the substrate to form a dopant-containing layer proximate an upper surface of the substrate, performing an epitaxial deposition process to form an undoped semiconducting material above the dopant-containing layer, forming a plurality of spaced-apart trenches that extend at least partially into the substrate, wherein the trenches define a fin for the device comprised of at least the undoped semiconducting material, forming at least a local isolation insulating material in the trenches, and forming a gate structure around at least the undoped semiconducting material, wherein a bottom of a gate electrode is positioned approximately level with or below a bottom of the undoped semiconducting material.

First claim

Opening claim text (preview).

What is claimed: 1. A method of forming a device in and above a semiconducting substrate, comprising: prior to forming an isolation region in said substrate for said device, forming a doped well region and a doped punch-stop region in said substrate; introducing dopant material into said substrate to form a dopant-containing layer proximate an upper surface of said substrate, wherein said dopant material is adapted to retard diffusion of boron or phosphorous; performing an epi…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8969932B2 cover?
One method disclosed herein includes, prior to forming an isolation region in a semiconducting substrate for the device, forming a doped well region and a doped punch-stop region in the substrate, introducing a dopant material that is adapted to retard diffusion of boron or phosphorous into the substrate to form a dopant-containing layer proximate an upper surface of the substrate, performing a…
Who is the assignee on this patent?
Globalfoundries Inc
What technology area does this patent fall under?
Primary CPC classification H10D30/024. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).