Moisture curable compositions
US-2024400829-A1 · Dec 5, 2024 · US
Pattern-forming method
US8968586B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8968586-B2 |
| Application number | US-201213397017-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2012 |
| Priority date | Feb 15, 2012 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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Abstract
Official abstract text for this publication.
A pattern-forming method includes forming a prepattern on a substrate. A space other than a space in which the prepattern is formed on the substrate is filled with a resin composition containing a compound which is diffusible into the prepattern. The compound is diffused into a part of the prepattern. Portions in which the compound is undiffused in the prepattern are removed using a removing liquid.
First claim
Opening claim text (preview).
What is claimed is: 1. A pattern-forming method comprising: providing a resist film on a substrate; exposing the resist film selectively to form a more-polar site and a less-polar site in the resist film, the more-polar site being more polar than the less-polar site and being generated by an exposure to light; removing the less-polar site and leaving the more-polar site using a developing solution comprising an organic solvent to form a prepattern on the substrate; filling a…
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Electricity · mapped topic
Electricity · mapped topic
Physics · mapped topic
Physics · mapped topic
- C09D183/04Primary
Chemistry & Metallurgy · mapped topic
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- What does patent US8968586B2 cover?
- A pattern-forming method includes forming a prepattern on a substrate. A space other than a space in which the prepattern is formed on the substrate is filled with a resin composition containing a compound which is diffusible into the prepattern. The compound is diffused into a part of the prepattern. Portions in which the compound is undiffused in the prepattern are removed using a removing li…
- Who is the assignee on this patent?
- Namai Hayato, Jsr Corp
- What technology area does this patent fall under?
- Primary CPC classification C09D183/04. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).