Semiconductor device manufacturing method and semiconductor device manufactured using the same
US-2024395745-A1 · Nov 28, 2024 · US
US8964085B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8964085-B2 |
| Application number | US-201313942428-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 15, 2013 |
| Priority date | Mar 8, 2010 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Official abstract text for this publication.
In a CMOS image sensor in which a plurality of pixels is arranged in a matrix, a transistor in which a channel formation region includes an oxide semiconductor is used for each of a charge accumulation control transistor and a reset transistor which are in a pixel portion. After a reset operation of the signal charge accumulation portion is performed in all the pixels arranged in the matrix, a charge accumulation operation by the photodiode is performed in all the pixels, and a read operation of a signal from the pixel is performed per row. Accordingly, an image can be taken without a distortion.
Opening claim text (preview).
The invention claimed is: 1. A semiconductor device comprising: a plurality of pixels arranged in a matrix, each of the plurality of pixels comprising: a photodiode; a signal charge accumulation portion; a charge accumulation control transistor, wherein one of a source and a drain of the charge accumulation control transistor is electrically connected to the photodiode and the other of the source and the drain of the charge accumulation control transistor is electrically conn…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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