No flow underfill or wafer level underfill and solder columns
US-9343423-B2 · May 17, 2016 · US
Shih Da-Yuan holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Feb 24, 2015 |
| Latest publication | May 17, 2016 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-9343423-B2 · May 17, 2016 · US
US-9082762-B2 · Jul 14, 2015 · US
US-2015147846-A1 · May 28, 2015 · US
US-2015147851-A1 · May 28, 2015 · US
US-8963340-B2 · Feb 24, 2015 · US
Representative or frequently cited publications from precomputed assignee stats.
US-9343423-B2 · May 17, 2016 · US
US-9082762-B2 · Jul 14, 2015 · US
US-2015147846-A1 · May 28, 2015 · US
US-2015147851-A1 · May 28, 2015 · US
US-8963340-B2 · Feb 24, 2015 · US
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/252 | 5 |
| H10W72/072 | 5 |
| H10W90/701 | 5 |
| H01L24/81 | 5 |
| H10P95/60 | 4 |
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |
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