Air gap spacer formation for nano-scale semiconductor devices
US-2024079266-A1 · Mar 7, 2024 · US
US8963294B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8963294-B2 |
| Application number | US-85780607-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 19, 2007 |
| Priority date | Sep 19, 2005 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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A method, structure and alignment procedure, for forming a finFET. The method including, defining a first fin of the finFET with a first mask and defining a second fin of the finFET with a second mask. The structure including integral first and second fins of single-crystal semiconductor material and longitudinal axes of the first and second fins aligned in the same crystal direction but offset from each other. The alignment procedure including simultaneously aligning alignment marks on a gate mask to alignment targets formed separately by a first masked used to define the first fin and a second mask used to define the second fin.
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What is claimed is: 1. A structure, comprising: an insulating layer formed on a top surface of a supporting substrate; single-crystal silicon first and second fins on a top surface of said insulating layer; single-crystal silicon first, second and third blocks on said top surface of said insulating layer, said second block between said first and third blocks, said first fin between and connecting said first block to said second block, said second fin between and connecting sai…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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