Semiconductor die, semiconductor package and substrate dicing method
US-2024421000-A1 · Dec 19, 2024 · US
US8962363B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8962363-B2 |
| Application number | US-201414298722-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2014 |
| Priority date | Jun 13, 2013 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Provided is a novel method for forming a groove composed of two smooth inclined surfaces on a surface of a flat plate formed of a nitride semiconductor crystal having an A, C, M-axes. In the present invention, a disk-shaped dicing blade is moved along a direction of the A-axis to form first and second inclined surfaces on the surface of the flat plate. The following mathematical formulae (I)-(III) are satisfied: 45 degrees≦θb−a≦60 degrees (I) 45 degrees≦θb+a≦60 degrees (II), 0 degrees≦|a|≦7.5 degrees, where angle θb represents an angle formed between a surface of the edge and a radial direction of the dicing blade in a cross-sectional view which includes the M-axis and the C-axis. The angle a represents an angle formed between the principal surface and the M-axis.
Opening claim text (preview).
The invention claimed is: 1. A method for forming a groove on a surface of a flat plate formed of a nitride semiconductor crystal having an A-axis, a C-axis, and an M-axis, the method comprising: (a) moving a disk-shaped dicing blade along a direction of the A-axis to form a first inclined surface and a second inclined surface on the surface of the flat plate, wherein the flat plate has a principal surface; the disk-shaped dicing blade has an edge along the circumference there…
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.