Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
US8960657B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8960657-B2 |
| Application number | US-201113253509-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 5, 2011 |
| Priority date | Oct 5, 2011 |
| Publication date | Feb 24, 2015 |
| Grant date | Feb 24, 2015 |
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Systems and methods are disclosed for connecting an ingot to a wire saw with an ingot holder, a bond beam, and a bar. The bar has an angled mating surface that engages a recessed surface formed in a slot of the bond beam. Mechanical fasteners are used to connect the tee bar to the ingot holder. The angle of the mating surface with respect to the recessed surface of the slot prevents deformation of the bond beam and prevents compromising the integrity of the adhesive bond between the ingot and the bond beam.
Opening claim text (preview).
What is claimed is: 1. A system for connecting an ingot to a rail of a wire saw machine, the system comprising: an ingot holder connected to the rail of the wire saw machine and connected to the bond beam; a bond beam having a first surface and an opposing second surface, the first surface connected to the ingot holder and having a slot formed therein, a pair of protrusions positioned adjacent the slot, the slot having an upward-facing recessed surface, the second surface connec…
Cross-Sectional Technologies · mapped topic
Operations & Transport · mapped topic
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Operations & Transport · mapped topic
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