Cleaning solution comprising an ether acetate for preventing pattern collapse

Patent metadata

Field	Value
Publication number	US-8957006-B2
Application number	US-201313794304-A
Country	US
Kind code	B2
Filing date	Mar 11, 2013
Priority date	Mar 11, 2013
Publication date	Feb 17, 2015
Grant date	Feb 17, 2015

Abstract

A chemical solution for use in cleaning a patterned substrate includes water, from approximate 0.01 to 99.98 percent by weight; hydrogen peroxide, from 0 to 30 percent by weight; a pH buffering agent, from approximate 0.01 to 50 percent by weight; a metal chelating agent, from approximate 0 to 10 percent by weight; and a compound for lowering a surface tension of the combination of water, hydrogen peroxide, pH buffering agent, and metal chelating agent. Examples of the compound include an organic solvent, from approximate 0 to 95 percent by weight, or a non-ionic surfactant agent, from approximate 0 to 2 percent by weight.

First claim

What is claimed is:

1. A chemical solution for use in cleaning a patterned substrate, the chemical solution comprising:
water, from approximately 0.01 to 99.98 percent by weight;
hydrogen peroxide, from 0 to 30 percent by weight;
a pH buffering agent, from approximately 0.01 to 50 percent by weight;
a metal chelating agent, from approximately 0 to 10 percent by weight;
a compound for lowering a surface tension of the combination of water, hydrogen peroxide, pH buffering ag…

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Ting Chih-Yuan
• Chen Jeng-Shiou

Classifications

• H10P70/23

  Electricity · mapped topic

• H10P70/20

  Electricity · mapped topic

• H10W20/01

  Electricity · mapped topic

• H10W10/17

  Electricity · mapped topic

• H10W10/014

  Electricity · mapped topic