System and method for using waste heat generated by digital processing components
US-2024057289-A1 · Feb 15, 2024 · US
Immersion-cooled and conduction-cooled electronic system
US8947873B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8947873-B2 |
| Application number | US-201213684712-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 26, 2012 |
| Priority date | Nov 26, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.
First claim
Opening claim text (preview).
What is claimed is: 1. A cooled electronic system comprising: an electronics board comprising a plurality of electronic components mounted to the electronics board; and a cooling apparatus facilitating cooling of the plurality of electronic components mounted to the electronics board, the cooling apparatus comprising: an immersion-cooled electronic component section comprising: an enclosure at least partially surrounding and forming a compartment about multiple electronic comp…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K7/20236Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8947873B2 cover?
- A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compa…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20236. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).