3-d structured two-phase cooling boilers with nano structured boiling enhancement coating
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Semiconductor module cooler and semiconductor module
US9220182B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9220182-B2 |
| Application number | US-201314105613-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2013 |
| Priority date | Jan 11, 2013 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbitrary positions. By doing so, the efficiency of transferring heat generated by the semiconductor element by a coolant is improved and cooling performance is improved.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor module cooler for supplying a coolant from an outside to a water jacket and cooling a semiconductor element arranged over an outer surface of the cooler, the cooler comprising: a heat sink which is thermally connected to the semiconductor element; a first flow path which is placed in the water jacket, which extends from a coolant introduction inlet, and in which a guide portion having an incline for leading the coolant toward one side of th…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10W40/47Primary
Electricity · mapped topic
- H05K7/20236Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9220182B2 cover?
- A semiconductor module cooler includes a fin which is a heat sink, which is thermally connected to a semiconductor element, and which has one or more notches in an edge at one or more arbitrary positions in a longitudinal direction and one or more convex ribs which are formed on a bottom of a water jacket having a cooling flow path and which fit into the one or more notches at one or more arbit…
- Who is the assignee on this patent?
- Honda Motor Co Ltd, Fuji Electric Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W40/47. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).