Method for manufacturing electronic device
US-2024258152-A1 · Aug 1, 2024 · US
US8946594B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8946594-B2 |
| Application number | US-201213649028-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2012 |
| Priority date | Nov 4, 2011 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Official abstract text for this publication.
Embodiments of the invention provide an apparatus including a substrate support, a source of laser radiation emitting laser radiation along an optical path, and an illumination optics disposed along the optical path. The illumination optics includes a set of slow-axis and fast-axis lenses. The apparatus further includes a homogenizer disposed between of the illumination optics and the substrate support along the optical path. The homogenizer includes a first and a second micro-optic lenslet arrays of cylindrical lenses, wherein the second micro-optic lenslet array of cylindrical lenses has a relatively larger lenslet pitch than that of the first micro-optic lenslet array of cylindrical lenses, and lenslet axes of the first micro-optic lenslet array and lenslet axes of the second micro-optic lenslet array are oriented along an axis that is parallel to a fast axis of the source of laser radiation.
Opening claim text (preview).
The invention claimed is: 1. A thermal processing apparatus for processing a semiconductor substrate, comprising: a substrate support; a source of laser radiation for emitting laser radiation along an optical path; an illumination optics disposed along the optical path, comprising: a set of slow-axis lenses having at least a first cylindrical lens and a second cylindrical lens spaced apart from each other; and a set of fast-axis lenses having at least a first cylindrical le…
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