Electronic package module and method for fabrication of the same
US-2024413067-A1 · Dec 12, 2024 · US
No-flow underfill for package with interposer frame
US8946072B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8946072-B2 |
| Application number | US-201213536905-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 28, 2012 |
| Priority date | Feb 2, 2012 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Abstract
Official abstract text for this publication.
Mechanisms of forming a package on package (PoP) package by using an interposer and an no-reflow underfill (NUF) layer are provided. The interposer frame improves the form factor of the package, enables the reduction in the pitch of the bonding structures. The NUF layer enables a semiconductor die and an interposer frame be bonded to a substrate by utilizing the heat on the connectors of the semiconductor die and on the connectors of the interposer frame for bonding. The heat provided by the semiconductor die and the interposer frame also transforms the NUF layer into an underfill. PoP structures formed by using the interposer frame and the NUF layer improve yield and have better reliability performance.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of forming a package on package structure, the method comprising: providing a substrate, wherein the substrate has a first plurality of bumps and a second plurality of bumps, wherein the second plurality of bumps surrounds the first plurality of bumps; applying a no-reflow underfill (NUF) layer over the substrate; bonding a semiconductor die to the first plurality of bumps on the substrate using heat supplied by the semiconductor die; and bond…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8946072B2 cover?
- Mechanisms of forming a package on package (PoP) package by using an interposer and an no-reflow underfill (NUF) layer are provided. The interposer frame improves the form factor of the package, enables the reduction in the pitch of the bonding structures. The NUF layer enables a semiconductor die and an interposer frame be bonded to a substrate by utilizing the heat on the connectors of the se…
- Who is the assignee on this patent?
- Wu Jiun Yi, Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10W74/114. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).