Method and apparatus for cleaning semiconductor wafer
US-2015332940-A1 · Nov 19, 2015 · US
US8945407B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945407-B2 |
| Application number | US-201113337374-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2011 |
| Priority date | Dec 27, 2011 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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A gas bearing seal using porous materials for distribution of gas flow can provide site isolation during wet processing. In some embodiments, a flow cell comprises a porous media gas bearing surrounding a periphery of the flow cell, isolating the liquid inside the flow cell from the ambient air outside the flow cell. In some embodiments, a protective chuck comprises a porous media gas bearing disposed in a middle of the protective chuck, isolating the liquid outside the protective chuck with the gaseous ambient generated by the porous media gas bearing.
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What is claimed is: 1. A method for processing a substrate, comprising providing a substrate, wherein the substrate comprises a first surface region and a second surface region; providing a flow cell, wherein the flow cell comprises a hollow interior operable to receive a fluid, a peripheral portion circumscribing the hollow interior, and an inlet operable to receive gas flow, wherein the peripheral portion comprises a bottom surface and the flow cell further comprises a porous…
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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