Deposition apparatus
US-2024052477-A1 · Feb 15, 2024 · US
US8945308B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945308-B2 |
| Application number | US-201213589631-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 20, 2012 |
| Priority date | May 9, 2007 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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Official abstract text for this publication.
The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.
Opening claim text (preview).
What is claimed is: 1. A transfer chamber, comprising: a main chamber body comprising a top, a bottom and a plurality of sidewalls defining a main volume, wherein each sidewall of the plurality of sidewalls has an opening formed therethrough; an extension chamber body comprising a top, a bottom, and at least a first sidewall and a second sidewall defining an extension volume, wherein the extension chamber body is separately connected to the opening formed in one of the sidewalls…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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