Transfer chamber with vacuum extension for shutter disks

US8945308B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8945308-B2
Application numberUS-201213589631-A
CountryUS
Kind codeB2
Filing dateAug 20, 2012
Priority dateMay 9, 2007
Publication dateFeb 3, 2015
Grant dateFeb 3, 2015

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

First claim

Opening claim text (preview).

What is claimed is: 1. A transfer chamber, comprising: a main chamber body comprising a top, a bottom and a plurality of sidewalls defining a main volume, wherein each sidewall of the plurality of sidewalls has an opening formed therethrough; an extension chamber body comprising a top, a bottom, and at least a first sidewall and a second sidewall defining an extension volume, wherein the extension chamber body is separately connected to the opening formed in one of the sidewalls…

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What does patent US8945308B2 cover?
The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to…
Who is the assignee on this patent?
Schaller Jason, Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification C23C14/568. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).