Systems and methods for monitoring and controlling industrial processes
US-2024361756-A1 · Oct 31, 2024 · US
Auto device skew manufacturing
US8942840B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8942840-B2 |
| Application number | US-201313743096-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 16, 2013 |
| Priority date | Jun 9, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufacturing process.
First claim
Opening claim text (preview).
What is claimed is: 1. A system for manufacturing a semiconductor device, the system comprising a first module to receive device parameters and output a main recipe based at least in part on the device parameters, wherein the device parameters are parameters of devices to be manufactured; a second module coupled to the first module to apply a compensation variable to the main recipe to form a control recipe, the control recipe controlling a semiconductor manufacturing process to…
Assignees
Inventors
Classifications
- G05B19/41865Primary
Physics · mapped topic
- G06F30/39Primary
Physics · mapped topic
Physics · mapped topic
- G06F17/5068Primary
Physics · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US8942840B2 cover?
- A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufactur…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification G05B19/41865. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).