Harmonic resist model for use in a lithographic apparatus and a device manufacturing method

US8942463B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8942463-B2
Application numberUS-201414224534-A
CountryUS
Kind codeB2
Filing dateMar 25, 2014
Priority dateNov 24, 2008
Publication dateJan 27, 2015
Grant dateJan 27, 2015

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Abstract

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A method for determining an image of a mask pattern in a resist coated on a substrate, the method including determining an aerial image of the mask pattern at substrate level; and convolving the aerial image with at least two orthogonal convolution kernels to determine a resist image that is representative of the mask pattern in the resist.

First claim

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What is claimed is: 1. A method implemented by a computer processor for simulating a resist image, wherein the resist image comprises an image of a portion of a design layout to be lithographically projected onto a resist coated on a substrate, the method comprising: determining an aerial image of the portion of the design layout at substrate level; and transforming the aerial image into the resist image by convolving the aerial image with selected convolution kernels having both linear and bilinear terms. 2. The method of claim 1 , wherein the transforming step includes: selecting the convolution kernels that form a complete basis, covering a vector space of all possible resist images. 3. The method of claim 1 , wherein the transforming step includes: selecting the convolution kernels that form an orthogonal basis, wherein correlation between the selected convolution kernels is minimal. 4. The method of claim 3 , wherein the selected convolution kernels comprise solutions of a two-dimensional quantum harmonic oscillator. 5. The method of claim 4 , wherein the solutions are based on Laguerre and Whittaker functions that modulate Gaussian kernels and form the orthogonal basis. 6. The method of claim 1 , wherein the transforming step includes: selecting the convolution kernels to preserve mirror symmetry of the resist image. 7. The method of claim 1 , wherein the transforming step further includes: selecting the convolution kernels such that a pair of convolution kernels has rotationally-independent bilinear terms, thereby preserving rotational symmetry of the resist image. 8. The method of claim 1 , wherein the simulation of the resist image is based on an empirical model. 9. The method of claim 8 , wherein the bilinear terms in the convolution kernels conceptually approximate chemical reaction-diffusion equations in the empirical model. 10. A non-transitory computer program product having computer executable instructions for a computer processor to perform a method for simulating a resist image, wherein the resist image comprises an image of a portion of a design layout to be lithographically projected onto a resist coated on a substrate, the method comprising: determining an aerial image of the portion of the design layout at substrate level; and transforming the aerial image into the resist image by convolving the aerial image with selected convolution kernels having both linear and bilinear terms. 11. The computer program product of claim 10 , wherein the transforming step includes: selecting the convolution kernels that form a complete basis, covering a vector space of all possible resist images. 12. The computer program product of claim 10 , wherein the transforming step includes: selecting the convolution kernels that form an orthogonal basis, wherein correlation between the selected convolution kernels is minimal. 13. The computer program product of claim 12 , wherein the selected convolution kernels comprise solutions of a two-dimensional quantum harmonic oscillator. 14. The computer program product of claim 13 , wherein the solutions are based on Laguerre and Whittaker functions that modulate Gaussian kernels and form the orthogonal basis. 15. The computer program product of claim 10 , wherein the transforming step includes: selecting the convolution kernels to preserve mirror and rotational symmetry of the resist image. 16. The computer program product of claim 15 , wherein the transforming step further includes: selecting the convolution kernels such that a pair of convolution kernels has rotationally-independent bilinear terms, thereby preserving rotational symmetry of the resist image. 17. The computer program product of claim 10 , wherein the simulation of the resist image is based on an empirical model. 18. The computer program product of claim 17 , wherein the bilinear terms in the convolution kernels conceptually approximate chemical reaction-diffusion equations in the empirical model. 19. A method implemented by a computer processor for simulating an image of a portion of a design layout to be lithographically etched on a substrate, the method comprising: determining an aerial image of the portion of the design layout at substrate level; and transforming the aerial image into an etch image by convolving the aerial image with selected convolution kernels, having both linear and bilinear terms, wherein the etch image is representative of the image of the design layout lithographically etched on the substrate. 20. The method of claim 19 , wherein the transforming step includes: selecting the convolution kernels that form a complete basis, covering a vector space of all possible etch images. 21. The method of claim 19 , wherein the transforming step includes: selecting the convolution kernels that form an orthogonal basis, wherein correlation between the selected convolution kernels is minimal. 22. The method of claim 21 , wherein the selected convolution kernels comprise solutions of a two-dimensional quantum harmonic oscillator. 23. The method of claim 22 , wherein the solutions are based on Laguerre and Whittaker functions that modulate Gaussian kernels and form the orthogonal basis. 24. The method of claim 19 , wherein the transforming step includes: selecting the convolution kernels to preserve mirror symmetry of the etch image. 25. The method of claim 19 , wherein the transforming step further includes: selecting the convolution kernels such that a pair of convolution kernels has rotationally-independent bilinear terms, thereby preserving rotational symmetry of the etch image. 26. The method of claim 19 , wherein the simulation of the etch image is based on an empirical model.

Assignees

Inventors

Classifications

  • G03F7/705Primary

    Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title

  • Industrial image inspection · CPC title

  • G06T3/0056Primary

    Physics · mapped topic

  • Latent image, i.e. measuring the image of the exposed resist prior to development · CPC title

  • Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system · CPC title

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What does patent US8942463B2 cover?
A method for determining an image of a mask pattern in a resist coated on a substrate, the method including determining an aerial image of the mask pattern at substrate level; and convolving the aerial image with at least two orthogonal convolution kernels to determine a resist image that is representative of the mask pattern in the resist.
Who is the assignee on this patent?
Asml Netherlands Bv
What technology area does this patent fall under?
Primary CPC classification G03F7/705. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).