Current sensor for a printed circuit board
US-2024237215-A1 · Jul 11, 2024 · US
Printed circuit board having electronic components embedded therein
US8942004B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8942004-B2 |
| Application number | US-97237110-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 17, 2010 |
| Priority date | Oct 7, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board having electronic components embedded therein, comprising: a metal core layer having a cavity formed thereon; an electronic component embedded in the cavity and having a plurality of terminals, a first ground terminal included in the plurality of terminals being connected to the metal core layer; a first internal insulating layer stacked on one side of the metal core layer; a second internal insulating layer stacked on the other…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8942004B2 cover?
- Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of t…
- Who is the assignee on this patent?
- Hong Suk Chang, Choi Bong Kyu, Yoo Je Gwang, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification H05K1/185. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).