Methods of forming semiconductor devices
US-2024387699-A1 · Nov 21, 2024 · US
Double patterning with inline critical dimension slimming
US8940475B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940475-B2 |
| Application number | US-201113158868-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 13, 2011 |
| Priority date | Nov 23, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
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A method for double patterning a substrate is described. The double patterning method may include a litho/freeze/litho/etch (LFLE) technique that includes a first (critical dimension) CD slimming process to reduce the first CD to a first reduced CD and a second CD slimming process to reduce the second CD to a second reduced CD.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for double patterning a substrate, comprising: forming a first layer of radiation-sensitive material; preparing a first pattern in said first layer of radiation-sensitive material using a first lithographic process, said first pattern being characterized by a first critical dimension (CD); following said preparing said first pattern, performing a first CD slimming process to reduce said first CD to a first reduced CD; freezing said first…
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Electricity · mapped topic
- H10P76/4085Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Physics · mapped topic
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- What does patent US8940475B2 cover?
- A method for double patterning a substrate is described. The double patterning method may include a litho/freeze/litho/etch (LFLE) technique that includes a first (critical dimension) CD slimming process to reduce the first CD to a first reduced CD and a second CD slimming process to reduce the second CD to a second reduced CD.
- Who is the assignee on this patent?
- Dunn Shannon W, Hetzer Dave, Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P76/4085. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).