Method and apparatus for cleaning semiconductor wafer
US-2015332940-A1 · Nov 19, 2015 · US
US8940102B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8940102-B2 |
| Application number | US-201213535322-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 27, 2012 |
| Priority date | Jan 8, 2009 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.
Opening claim text (preview).
We claim: 1. A method of removing particles from over a surface of a semiconductor substrate, comprising: flowing a liquid across the surface of the substrate and the particles, the liquid having thickness over the substrate, a first region of the thickness being near the substrate and comprising particles, a second region of the thickness being further from the substrate than the first region and having more flow than the first region; while the liquid is flowing, imparting an…
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