Socket connector for an electronic package
US-10879638-B2 · Dec 29, 2020 · US
Method of mounting a circuit board
US8938876B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8938876-B2 |
| Application number | US-201113311956-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2011 |
| Priority date | May 6, 2010 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion of the circuit board. The support structure includes a plurality of nested frames. In another aspect, a socket with a with socket cover coupled to a socket housing is disclosed. The socket housing includes a support structure to support a portion of the socket cover.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of mounting a circuit board, comprising: placing the circuit board in a socket, the socket including a socket cover coupled to a socket housing, the socket housing having a first surface with plural cavities and a first support structure projecting away from the first surface and adapted to support a portion of the socket cover, the first support structure including a first plurality of nested frames; and securing the circuit board to the socket.…
Assignees
Inventors
Classifications
- H05K7/1084Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US8938876B2 cover?
- Various circuit board sockets and methods of manufacturing and using the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a socket that is operable to receive a circuit board. The socket includes a surface for seating a first portion of a circuit board, a floor and a first support structure projecting away from the floor to support a second portion …
- Who is the assignee on this patent?
- Heng Stephen F, Hardikar Mahesh S, Advanced Micro Devices Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K7/1084. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).