Chip structure
US-2019198473-A1 · Jun 27, 2019 · US
US10665151B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10665151-B2 |
| Application number | US-201716306830-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 30, 2017 |
| Priority date | Oct 31, 2016 |
| Publication date | May 26, 2020 |
| Grant date | May 26, 2020 |
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Official abstract text for this publication.
A driver circuit carrier, a display panel, and a manufacturing method are provided. The driver circuit carrier includes a substrate, and a number of first pins arranged on at least one surface of the substrate. The first pins are arranged along a first reference line. An imaginary extending line of at least one of the first pins intersects with a second reference line perpendicular to the first reference line.
Opening claim text (preview).
What is claimed is: 1. A driver circuit carrier, bonded to a display panel, comprising: a substrate; and a plurality of first pins arranged on at least one surface of the substrate, the plurality of first pins arranged along a first reference line, an imaginary extending line of at least one of the first pins intersecting with a second reference line perpendicular to the first reference line, wherein the plurality of first pins are divided into a plurality of first-pin groups ea…
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