Electronic assembly with detachable coolant manifold and coolant-cooled electronic module

Patent metadata

Field	Value
Publication number	US-8937810-B2
Application number	US-201213616337-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Sep 14, 2012
Publication date	Jan 20, 2015
Grant date	Jan 20, 2015

Abstract

Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

First claim

What is claimed is:

1. A cooled electronic assembly comprising:
a coolant-cooled electronic module, the coolant-cooled electronic module comprising:
at least one electronic component; and
at least one coolant-carrying channel integrated within the coolant-cooled electronic module and configured to facilitate flow of coolant therethrough for cooling the at least one electronic component;

a coolant manifold structure detachably coupled to the coolant-cooled electronic module, the coolant manifold structure comprising a coolant inlet and a coolant outlet in fluid communication with the at least one coolant-carrying channel of the coolant-cooled electronic module, the coolant manifold structure facilitating the flow of the coolant through the at least one coolant-carrying channel of the coolant-cooled electronic module, and thereby cooling of the at least one electronic component; and
a coolant-absorbent material positioned at an interface of the coolant-cooled electronic module and the coolant manifold structure, the coolant-absorbent material absorbing excess of the coolant at the interface during detaching of the coolant manifold structure from the coolant-cooled electronic module, the coolant-absorbent material is a compressible, coolant-absorbent material positioned at the interface of the coolant-cooled electronic module and the coolant manifold structure, and wherein the coolant manifold structure is detachably coupled to the coolant-cooled electronic module in one of a first position or a second position, the coolant-absorbent material being at least partially compressed in the first position, and at least partially uncompressed in the second position, the second position facilitating the coolant-absorbent material's absorbing of the coolant at the interface during detaching of the coolant manifold structure from the coolant-cooled electronic module.

2. The cooled electronic assembly of claim 1 , wherein the coolant-absorbent material resides at least partially within a recess in at least one of the coolant-cooled electronic module or the coolant manifold structure at the interface of the coolant-cooled electronic module and the coolant manifold structure.

3. The cooled electronic assembly of claim 1 , further comprising an outer containment ring configured to define, at least partially, a containment volume between the coolant manifold structure and the coolant-cooled electronic module with the coolant manifold structure in the second position, wherein the coolant-absorbent material at least partially resides within the containment volume with the coolant manifold structure in the second position.

4. The cooled electronic assembly of claim 3 , further comprising at least one inner containment ring configured to define, with the coolant manifold structure detachably coupled to the coolant-cooled electronic module in the first position, a coolant-tight seal where at least one of the coolant inlet or the coolant outlet of the coolant manifold structure is in fluid communication with the at least one coolant-carrying channel of the coolant-cooled electronic module and, with the coolant manifold structure detachably coupled to the coolant-cooled electronic module in the second position, to unseal where the at least one of the coolant inlet or the coolant outlet of the coolant manifold structure is in fluid communication with the at least one coolant-carrying channel of the coolant-cooled electronic module, thereby allowing any of the coolant at the interface between the coolant manifold structure and the coolant-cooled electronic module into the containment volume defined, at least partially, by the outer containment ring.

5. The cooled electronic assembly of claim 1 , further comprising at least one compression fastener and at least one retention fastener, the at least one compression fastener holding the coolant manifold structure in the first position relative to the coolant-cooled electronic module, and upon removal of the at least one compression fastener, the at least one retention fastener holding the coolant manifold structure in the second position relative to the coolant-cooled electronic module.

6. The cooled electronic assembly of claim 5 , further comprising at least one elastic member disposed between the coolant manifold structure and the coolant-cooled electronic module, the at least one elastic member facilitating moving of the coolant manifold structure from the first position to the second position with detaching of the at least one compression fastener.

7. The cooled electronic assembly of claim 1 , wherein the coolant inlet of the coolant manifold structure comprises a first manifold and the coolant outlet of the coolant manifold structure comprises a second manifold, and wherein the coolant manifold structure further comprises a first fluid-tight gasket around the first manifold and a second fluid-tight gasket around the second manifold at the interface of the coolant manifold structure and the coolant-cooled electronic module.

8. The cooled electronic assembly of claim 1 , wherein the coolant-cooled electronic module comprises a module lid, the module lid at least partially enclosing at least one electronic component, and wherein the at least one coolant-carrying channel is integrated within the module lid, and is disposed within the coolant-cooled electronic module and coupled to the at least one electronic component.

9. A method of fabricating a cooled electronic assembly comprising:
providing a coolant-cooled electronic module comprising:
at least one electronic component; and
at least one coolant-carrying channel integrated within the coolant-cooled electronic module and configured to facilitate flow of coolant therethrough for cooling the at least one electronic component; and

detachably coupling a coolant manifold structure to the coolant-cooled electronic module, the coolant manifold structure comprising a coolant inlet and a coolant outlet within the coolant manifold structure, the detachably coupling comprising coupling in fluid communication the coolant inlet and the coolant outlet of the coolant manifold structure to the at least one coolant-carrying channel of the coolant-cooled electronic module, the coolant manifold structure facilitating the flow of the coolant through the at least one coolant-carrying channel of the coolant-cooled electronic module, and thereby cooling of the at least one electronic component; and
providing a coolant-absorbent material positioned at an interface of the coolant-cooled electronic module and the coolant manifold structure, the coolant-absorbent material absorbing excess of the coolant at the interface during detaching of the coolant manifold structure from the coolant-cooled electronic module, the coolant-absorbent material is a compressible, coolant-absorbent material positioned at the interface of the coolant-cooled electronic module and the coolant manifold structure, and wherein the coolant manifold structure is detachably coupled to the coolant-cooled electronic module in one of a first position or a second position, the coolant-absorbent material being at least partially compressed in the first position, and at least partially uncompressed in the second position, the second position facilitating the coolant-absorbent material's absorbing of the coolant at the interface during detaching of the coolant manifold structure from the coolant-cooled electronic module.

10. The method of claim 9 , further comprising providing an outer containment ring configured to define, at least partially, a containment volume between the coolant manifold structure and the coolant-cooled electronic module with the coolant manifold structure in the second position, wherein th

Assignees

• Brunschwiler Thomas J
• Colgan Evan G
• Ellsworth Jr Michael J
• Escher Werner
• Meijer Ingmar G
• Paredes Stephan
• Schlottig Gerd
• Witzig Martin
• Zitz Jeffrey A
• IBM

Inventors

• Brunschwiler Thomas J
• Colgan Evan G
• Ellsworth Jr Michael J
• Escher Werner
• Meijer Ingmar G
• Paredes Stephan
• Schlottig Gerd
• Witzig Martin
• Zitz Jeffrey A

Classifications

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• Y10T29/49002

  Electrical device making · CPC title