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Liquid treatment apparatus and liquid treatment method
US8937014B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8937014-B2 |
| Application number | US-201113879175-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2011 |
| Priority date | Oct 14, 2010 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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- Title
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Abstract
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A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.
First claim
Opening claim text (preview).
What is claimed is: 1. A liquid treatment apparatus of continuously performing a plating process on a plurality of substrates, the liquid treatment apparatus comprising: a temperature controlling container configured to accommodate a plating liquid; a temperature controller configured to control a temperature of the plating liquid accommodated in the temperature controlling container; a holding unit configured to hold the substrates one by one at a predetermined position; a…
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Inventors
Classifications
Electricity · mapped topic
- H10P72/0476Primary
Electricity · mapped topic
- C23C18/1675Primary
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US8937014B2 cover?
- A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply …
- Who is the assignee on this patent?
- Tanaka Takashi, Saito Yusuke, Iwashita Mitsuaki, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0476. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).