Methods of forming semiconductor devices
US-2024387699-A1 · Nov 21, 2024 · US
US8936729B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8936729-B2 |
| Application number | US-201213603924-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 5, 2012 |
| Priority date | Dec 20, 2011 |
| Publication date | Jan 20, 2015 |
| Grant date | Jan 20, 2015 |
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According to one embodiment, a planarizing method is proposed. In the planarizing method, a surface to be processed of an object to be processed including a silicon oxide film is planarized in a processing solution by bringing the surface to be processed into contact with or close proximity with the surface of a solid-state plate on which fluorine is adsorbed. The bonding energy between fluorine and the solid-state plate is lower than that between fluorine and silicon.
Opening claim text (preview).
What is claimed is: 1. A method for chemically planarizing a silicon oxide containing surface of an object to be processed, the method comprising: immersing the silicon oxide containing surface and an ion exchanger on which fluorine is absorbed into a processing fluid, wherein bonding energy between fluorine and the ion exchanger, bonding energy between fluorine and silicon, and bonding energy between anions contained in the processing solution and the ion exchanger, are such that…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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