Vibration Measurement Device
US-2024410745-A1 · Dec 12, 2024 · US
Monitoring incident beam position in a wafer inspection system
US8934091B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8934091-B2 |
| Application number | US-201313794030-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2013 |
| Priority date | Sep 9, 2012 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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Abstract
Official abstract text for this publication.
Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.
First claim
Opening claim text (preview).
What is claimed is: 1. A structure configured for monitoring incident beam position in a wafer inspection system, comprising: a chuck configured to support a wafer during inspection by the wafer inspection system, wherein the chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection; and a feature formed in the chuck, wherein an axis through the center of the feature is aligned with a radius of the chuck such…
Assignees
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Classifications
- H10P72/0606Primary
Electricity · mapped topic
Electricity · mapped topic
- G01J1/4257Primary
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US8934091B2 cover?
- Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through th…
- Who is the assignee on this patent?
- Kla Tencor Corp, Kla Tencor Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0606. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).