Electronic component package and method for manufacturing electronic component package
US-2024090133-A1 · Mar 14, 2024 · US
Semiconductor package, wiring board unit, and electronic apparatus
US8933558B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8933558-B2 |
| Application number | US-201213593733-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 24, 2012 |
| Priority date | Sep 30, 2011 |
| Publication date | Jan 13, 2015 |
| Grant date | Jan 13, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, comprising: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main b…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8933558B2 cover?
- A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal jo…
- Who is the assignee on this patent?
- Watanabe Manabu, Fukuzono Kenji, Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W76/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).