Methods for laser cutting glass substrates

Patent metadata

Field	Value
Publication number	US-8932510-B2
Application number	US-82460910-A
Country	US
Kind code	B2
Filing date	Jun 28, 2010
Priority date	Aug 28, 2009
Publication date	Jan 13, 2015
Grant date	Jan 13, 2015

Abstract

A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate.

First claim

What is claimed is:

1. A method of cutting a glass article from a strengthened glass substrate comprising a surface compression layer and a tensile layer, the method comprising:
forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate; and
propagating a through vent through the surface compression and tensile layers at the edge defect by creating a tensile stress field within the strengthened glass substrate that is present from the first edge to a second edge of the strengthened glass substrate along an entire length of a cut line, wherein the tensile stress field is formed by scanning a laser beam back and forth along the entire length of the cut line on the surface compression layer at a scanning speed equal to or greater than 0.5 m/s, the tensile stress field is perpendicular to the cut line, and the through vent precedes a region of separation along the cut line between the glass article and the strengthened glass substrate.

2. The method of claim 1 wherein the scanning of the laser beam generates a scanned laser line that is equal to or greater than the length of the cut line.

3. The method of claim 1 wherein:
the laser beam is scanned at a reference scanning speed when the laser beam is at a normal incidence angle relative to the strengthened glass substrate; and
the laser beam is scanned at a decreasing scanning speed that decreases from the reference scanning speed in accordance with an increasing angle of incidence of the scanned laser beam as the laser beam is scanned along the cut line.

4. The method of claim 1 wherein propagating the through vent at the edge defect further comprises:
scanning a laser beam back and forth along an entire length of the cut line; and
scanning the laser beam back and forth along a shortened scan line on the edge defect after scanning the laser beam back and forth along the entire length of the cut line for a period of time.

5. The method of claim 1 wherein the edge defect is formed by laser ablation or laser induced damage in a bulk region of the strengthened glass substrate.

6. A method of cutting a glass article from a strengthened glass substrate comprising a surface compression layer and a tensile layer, the method comprising scanning a laser beam incident on the surface compression layer and back and forth at a scanning speed equal to or greater than 0.5 m/s along an entire length of a cut line between the glass article and the strengthened glass substrate to create a tensile stress field that is present along an entire length of the cut line such that a through vent propagates along the cut line, wherein the scanning of the laser beam generates a scanned laser line present along the entire length of the cut line on the surface compression layer.

7. The method of claim 6 wherein the scanned laser line is equal to or greater than the length of the cut line.

8. The method of claim 6 wherein:
the laser beam is scanned at a reference scanning speed when the laser beam is at a normal incidence angle relative to the strengthened glass substrate; and
the laser beam is scanned at a decreasing scanning speed that decreases from the reference scanning speed in accordance with an increasing angle of incidence of the scanned laser beam as the laser beam is scanned along the cut line.

9. The method of claim 6 further comprising forming an edge defect on a first edge of the strengthened glass substrate, wherein the through vent initiates at the edge defect and precedes a region of separation along the cut line between the glass article and the strengthened glass substrate.

10. The method of claim 9 further comprising scanning the laser beam back and forth along a shortened scan line on the edge defect after scanning the laser beam back and forth along the entire length of the cut line for a period of time.

11. A method of cutting a strengthened glass substrate comprising a surface compression layer and a tensile layer, the method comprising:
forming an edge defect on the surface compression layer of the strengthened glass substrate, the edge defect positioned on a cut line extending from a first edge of the strengthened glass substrate to a second edge of the strengthened glass substrate; and
scanning a laser beam back and forth to generate a scanned laser line that extends along an entire length of the cut line to separate the strengthened glass substrate along the cut line, wherein the laser beam is scanned back and forth along the entire length of the cut line at a scanning speed equal to or greater than 0.5 m/s.

12. The method of claim 11 wherein the scanned laser line is equal to or greater than the length of the cut line.

13. The method of claim 11 wherein the cut line begins at a first edge of the strengthened glass substrate and terminates at a second edge of the strengthened glass substrate.

14. The method of claim 11 wherein the cut line begins and terminates at a single edge of the strengthened glass substrate.

15. The method of claim 11 wherein the method further comprises scanning the laser beam back and forth along a shortened scan line on the edge defect following scanning the laser beam back and forth along the entire length of the cut line.

16. The method of claim 11 wherein the laser beam is generated by a pulsed CO 2 laser operated at a frequency within a range of 0 Hz to 200 kHz.

17. The method of claim 11 wherein the method further comprises shaping the laser beam such that the laser beam illuminates an elliptical beam spot on the strengthened glass substrate, the elliptical beam spot having a major axis that is aligned with the cut line.

18. The method of claim 11 wherein the method further comprises applying a water jet to the edge defect after scanning the laser beam along the entire length of the cut line for a period of time.

19. The method of claim 1 wherein the through vent propagates through the surface compression and tensile layers at a speed of about 1.3 km/s.

Assignees

• Li Xinghua
• Moore Lisa Anne
• Corning Inc

Inventors

• Li Xinghua
• Moore Lisa Anne

Classifications

• C03B33/093 Primary

  using two or more focussed radiation beams · CPC title

• C03C23/0025 Primary

  by a laser beam · CPC title

• B23K26/4075

  Operations & Transport · mapped topic

• B23K26/00

  Working by laser beam, e.g. welding, cutting or boring · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title