System and method for using waste heat generated by digital processing components
US-2024057289-A1 · Feb 15, 2024 · US
Immersion-cooling of selected electronic component(s) mounted to printed circuit board
US8929080B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8929080-B2 |
| Application number | US-201313788987-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 7, 2013 |
| Priority date | Sep 26, 2012 |
| Publication date | Jan 6, 2015 |
| Grant date | Jan 6, 2015 |
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Abstract
Official abstract text for this publication.
A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of facilitating cooling of an electronic component, the method comprising: providing a housing assembly defining a compartment about the at least one electronic component, the at least one electronic component being coupled to a first side of a printed circuit board, and the providing of the housing assembly comprises: providing a first frame comprising at least one opening sized to accommodate the at least one electronic component therein, and cou…
Assignees
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Classifications
- H05K7/20236Primary
Electricity · mapped topic
Electricity · mapped topic
- H05K7/20Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US8929080B2 cover?
- A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate …
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20236. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).