Formation of alpha particle shields in chip packaging

Patent metadata

Field	Value
Publication number	US-8928145-B2
Application number	US-201213533182-A
Country	US
Kind code	B2
Filing date	Jun 26, 2012
Priority date	Aug 24, 2005
Publication date	Jan 6, 2015
Grant date	Jan 6, 2015

Abstract

A structure and system for forming the structure. The structure includes a semiconductor chip and an interposing shield having a top side and a bottom side. The semiconductor chip includes N chip electric pads, wherein N is a positive integer of at least 2. The N chip electric pads are electrically connected to a plurality of devices on the semiconductor chip. The electric shield includes 2N electric conductors and N shield electric pads. Each shield electrical pad is in electrical contact and direct physical contact with a corresponding pair of electric conductors of the 2N electric conductors. The interposing shield includes a shield material. The shield material includes a first semiconductor material. The semiconductor chip is bonded to the top side of the interposing shield. Each chip electric pads is in electrical contact and direct physical contact with a corresponding shield electrical pad of the N shield electric pads.

First claim

The invention claimed is:

1. A structure, comprising:
a semiconductor chip including N chip electric pads, wherein N is a positive integer of at least 2, and wherein the N chip electric pads are electrically connected to a plurality of devices on the semiconductor chip; and
an interposing shield having a top side and a bottom side,
wherein a first direction is perpendicular to the top side and the bottom side,
wherein the interposing shield comprises 2N electric conductors and N shield electric pads,
wherein each shield electrical pad is in electrical contact with and direct physical contact with a corresponding pair of electric conductors of the 2N electric conductors,
wherein the interposing shield comprises a shield material,
wherein the shield material comprises a first semiconductor material,
wherein the semiconductor chip is bonded to the top side of the interposing shield, and
wherein each chip electric pads is in electrical contact and direct physical contact with a corresponding shield electrical pad of the N shield electric pads.

2. The structure of claim 1 , further comprising:
N solder bumps on the bottom side of the interposing shield; and
a ceramic substrate comprising N substrate pads,
wherein each solder bump is in electrical contact with a corresponding pair of electric conductors of the 2N electric conductors,
wherein the N substrate pads each comprise an electrically conductive material, and
wherein each solder bumps is electrically connected to a corresponding substrate pad of the N substrate pads.

3. The structure of claim 2 , further comprising:
N aluminum pads such that each aluminum pad comprises aluminum,
wherein each aluminum pad is in direct physical and electrical contact with a corresponding solder bump of the N solder bumps,
wherein each aluminum pad is in direct physical and electrical contact with a corresponding pair of electric conductors of the 2N electric conductors, and
wherein each aluminum pad is disposed between the corresponding solder bump and the corresponding pair of electric conductors.

4. The structure of claim 3 , further comprising:
a dielectric layer comprising a dielectric material,
wherein the dielectric layer comprises the N aluminum pads,
wherein the dielectric material is in direct physical contact with at least one aluminum pad of the N aluminum pads and at least one solder bump of the N solder bumps,
wherein the dielectric material is not in direct physical contact with the shield material, and
wherein a portion of each solder bump is embedded in a corresponding via within the dielectric layer.

5. The structure of claim 3 , further comprising:
a copper layer comprising N copper regions such that each copper region comprises copper, wherein each copper region is electrically insulated from the first semiconductor material in the interposing shield.

6. The structure of claim 5 , further comprising:
a dielectric layer comprising a dielectric material,
wherein the dielectric layer comprises the N aluminum pads,
wherein the dielectric material is in direct physical contact with at least one aluminum pad of the N aluminum pads and at least one solder bump of the N solder bumps,
wherein the dielectric material is separated from the interposing shield by the copper layer which is disposed between the dielectric layer and the interposing shield, and
wherein a portion of each solder bump is embedded in a corresponding via within the dielectric layer.

7. The structure of claim 6 ,
wherein the copper layer comprises a copper volume comprising copper, a first dielectric region, and a second dielectric region,
wherein the copper volume is electrically insulated from the N copper regions by the first dielectric region and the second dielectric region, and
wherein the copper volume in direct physical contact with the first dielectric region, the second dielectric region, the dielectric material, and the shield material.

8. The structure of claim 2 ,
wherein the ceramic substrate generates alpha particles,
wherein the interposing shield is disposed between the ceramic substrate and the semiconductor chip, and
wherein the interposing shield is sufficiently thick in the first direction to prevent most of the alpha particles generated by the ceramic substrate from entering the semiconductor chip.

9. The structure of claim 1 , wherein the first semiconductor material is the only semiconductor material in the interposing shield.

10. A system for fabricating a structure, comprising:
means for bonding an integrated circuit to a top side of an interposing shield such that N chip electric pads comprised by the integrated circuit are in electrical contact with N electric conductors comprised by the interposing shield, wherein N is a positive integer of at least 2, wherein the N chip electric pads are electrically connected to a plurality of devices on the integrated circuit, wherein the interposing shield has said top side and a bottom side, and wherein the interposing shield comprises a first semiconductor material;
means for forming N solder bumps on the bottom side of the interposing shield such that the N solder bumps are in electrical contact with the N electric conductors; and
means for bonding a ceramic substrate to the N solder bumps such that N substrate pads comprised by the ceramic substrate are bonded to the N solder bumps,
wherein each electric conductor of the N electric conductors comprises an electrical pad, and
wherein said means for bonding the integrated circuit comprises means for bonding the integrated circuit to the top side of the interposing shield such that the N chip electric pads are in electrical contact and direct physical contact with corresponding electrical pads of the N electric conductors.

11. The system of claim 10 , wherein the first semiconductor material is the only semiconductor material in the interposing shield.

12. The system of claim 11 , wherein the first semiconductor material is silicon.

13. A system for fabricating a structure, comprising:
means for bonding an integrated circuit to a top side of an interposing shield such that N chip electric pads comprised by the integrated circuit are in electrical contact with N electric conductors comprised by the interposing shield, wherein N is a positive integer of at least 2, wherein the N chip electric pads are electrically connected to a plurality of devices on the integrated circuit, and wherein the interposing shield has said top side and a bottom side, and wherein the interposing shield comprises a first semiconductor material;
means for forming N solder bumps on the bottom side of the interposing shield such that the N solder bumps are in electrical contact with the N electric conductors;
means for bonding a ceramic substrate to the N solder bumps such that N substrate pads comprised by the ceramic substrate are bonded to the N solder bumps; and
means for forming a copper layer sandwiched between, and electrically insulated from, the N electric conductors and the N solder bumps.

14. The system of claim 13 , wherein a first direction from the top side to the bottom side is perpendicular to both the bottom side and to top side, wherein the copper layer has a thickness in a range of 10 μm to 15 μm in the first direction, and wherein the interposing shield has a thickness less than 1 μm in the first direction.

15. The system of claim 13 , wherein the copper layer comprises M copper regions, wherein M is at least 2, wherein each copper region comprises copper, wherein a first direction from the top side to the bottom side is perpendicu

Assignees

• Andry Paul Stephen
• Cabral Jr Cyril
• Rodbell Kenneth P
• Wisnieff Robert L
• IBM

Inventors

• Andry Paul Stephen
• Cabral Jr Cyril
• Rodbell Kenneth P
• Wisnieff Robert L

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07236

  Soldering or alloying · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title