Printed wiring board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-8925192-B2
Application number	US-75716310-A
Country	US
Kind code	B2
Filing date	Apr 9, 2010
Priority date	Jun 9, 2009
Publication date	Jan 6, 2015
Grant date	Jan 6, 2015

Abstract

A method for manufacturing printed wiring board includes irradiating laser on first surface of substrate such that first opening portion having first opening on the first surface and inner diameter decreasing toward the second surface is formed, irradiating laser on second surface of the substrate such that second opening portion having second opening on the second surface and inner diameter decreasing toward the first surface is formed and that the second portion joins the first portion and forms a penetrating hole penetrating through the substrate, forming a first circuit on the first surface, forming a second circuit on the second surface, and filling the hole with plating such that a through-hole conductor which electrically connects the first and second circuits is formed. The first opening has diameter same as or greater than diameter of the second opening, and the first portion has depth less than depth of the second portion.

First claim

What is claimed is:

1. A method for manufacturing a printed wiring board, comprising:
preparing a substrate comprising a cured resin material and having a first surface and a second surface on an opposite side of the first surface;
irradiating laser on a portion of the first surface of the substrate such that a first opening portion having a first opening on the first surface of the substrate and an inner diameter decreasing from the first surface toward the second surface is formed;
irradiating laser on a portion of the second surface of the substrate such that a second opening portion having a second opening on the second surface of the substrate and an inner diameter decreasing from the second surface toward the first surface is formed and that the second opening portion joins the first opening portion and forms a penetrating hole comprising the first opening portion and the second opening portion and penetrating through the substrate;
forming a first conductive circuit on the first surface of the substrate;
forming a second conductive circuit on the second surface of the substrate; and
filling the penetrating hole with plating such that a through-hole conductor which electrically connects the first conductive circuit and the second conductive circuit is formed in the penetrating hole,
wherein the first opening of the first opening portion on the first surface of the substrate has a diameter R 1 which is the same as or greater than a diameter R 2 of the second opening of the second opening portion on the second surface of the substrate, and the first opening portion has a depth D 1 which is less than a depth D 2 of the second opening portion; and wherein the first opening portion and the second opening portion have the depth D 1 and the depth D 2 whose sum is greater than a thickness of the substrate.

2. The method for manufacturing a printed wiring board according to claim 1 , wherein the first opening of the first opening portion has a circular shape, and the second opening of the second opening portion has a circular shape.

3. The method for manufacturing a printed wiring board according to claim 1 , wherein the first opening of the first opening portion has an oval shape, the second opening of the second opening portion has an oval shape, the diameter R 1 of the first opening is a major axis of the oval shape of the first opening, and the diameter R 2 of the second opening is a major axis of the oval shape of the second opening.

4. The method for manufacturing a printed wiring board according to claim 1 , wherein the first opening portion and the second opening portion are formed such that the first opening portion and the second opening portion satisfy |ΔZ 1 /ΔX|<|ΔZ 2 /ΔX|, where |ΔZ 1 /ΔX| is a degree of inclination of a tangent line to a curvature of an inner wall of the first opening portion, |ΔZ 2 /ΔX | is a degree of inclination of a tangent line to a curvature of an inner wall of the second opening portion, the tangent lines pass through an intersection point of the curvatures of the inner walls of the first and second opening portions, the curvatures of the inner walls of the first and second opening portions are on an X-Z plane perpendicular to the first and second surfaces of the substrate, and the degrees of inclinations are measured with respect to a straight line parallel to the first and second surfaces and passing through the intersection point.

5. The method for manufacturing a printed wiring board according to claim 1 , wherein the depth D 1 of the first opening portion is less than half a thickness of the substrate, and the depth D 2 of the second opening portion is deeper than half the thickness of the substrate.

6. The method for manufacturing a printed wiring board according to claim 1 , wherein the diameter R 1 of the first opening is greater than the diameter R 2 of the second opening.

7. The method for manufacturing a printed wiring board according to claim 4 , wherein the diameter R 1 of the first opening is greater than the diameter R 2 of the second opening.

8. The method for manufacturing a printed wiring board according to claim 1 , further comprising forming a built-up layer on at least one of the first surface and the second surface of the substrate.

9. The method for manufacturing a printed wiring board according to claim 1 , wherein the first opening portion and the second opening portion are formed such that a straight line passing through a gravity center of the first opening and perpendicular to the first surface and a straight line passing through a gravity center of the second opening and perpendicular to the first surface are at different positions.

10. The method for manufacturing a printed wiring board according to claim 1 , wherein the filling of the penetrating hole comprises plating a space in the penetrating hole such that the penetrating hole is closed by at least one plating material.

11. The method for manufacturing a printed wiring board according to claim 1 , wherein the irradiating on the portion of the second surface of the substrate comprises irradiating the portion of the second surface of the substrate such that the first opening portion and the second opening portion are obliquely joined.

Assignees

• Noda Kota
• Yamauchi Tsutomu
• Ibiden Co Ltd

Inventors

• Noda Kota
• Yamauchi Tsutomu

Classifications

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title