Thin-layer capacitors with large scale integration
US-2015380168-A1 · Dec 31, 2015 · US
High-power and high energy-density capacitor with scavenger
US2026081073A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2026081073-A1 |
| Application number | US-202519323487-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 9, 2025 |
| Priority date | Sep 18, 2024 |
| Publication date | Mar 19, 2026 |
| Grant date | — |
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Abstract
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An apparatus and method of constructing high power density capacitors. The apparatus and method may include scavenging materials between and around high-permittivity dielectric sections. Scavenging materials are added to the capacitor to remove electrons or holes that can lead to breakdown, without substantially reducing capacitance.
First claim
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1 . A capacitor apparatus comprising: at least one scavenger material, and at least one high-permittivity dielectric material, wherein the presence of the scavenger material increases the breakdown voltage of the capacitor by at least a factor of 5 without substantially reducing the capacitance. 2 . The apparatus of claim 1 , wherein the high-permittivity dielectric material has a permittivity of more than 100. 3 . The apparatus of claim 1 , wherein the high-permittivity dielectric material has a permittivity of more than 1,000. 4 . The apparatus of claim 1 , wherein the high-permittivity dielectric material has a permittivity of more than 100,000. 5 . The apparatus of claim 1 , wherein at least one of the scavenger materials is a scavenger of electrons. 6 . The apparatus of claim 1 , wherein at least one of the scavenger materials is a scavenger of holes. 7 . The apparatus of claim 1 , wherein at least one of the scavenger materials is initially a gas. 8 . The apparatus of claim 6 , wherein a pressure within a capacitor enclosure at the time the capacitor is formed is higher than one bar. 9 . The apparatus of claim 1 , wherein at least one of the scavenger materials is initially a liquid. 10 . A method for manufacturing capacitors comprising: combining scavenger material with high-permittivity dielectric material, and enclosing the combined scavenger material and high permittivity dielectric material, wherein the scavenger material increases the breakdown voltage of the capacitor by at least a factor of 5 without substantially reducing the capacitance. 11 . The method of claim 10 , wherein the high-permittivity dielectric material is exposed to the at least one of the scavenger materials prior to enclosure. 12 . The method of claim 10 , wherein the high-permittivity dielectric material is exposed to at least one of the scavenger materials at the time of enclosure. 13 . The method of claim 10 , wherein at least one of the high-permittivity dielectric materials has a permittivity of more than 100. 14 . The method of claim 10 , wherein at least one of the high-permittivity dielectric materials has a permittivity of more than 1,000. 15 . The method of claim 10 , wherein at least one of the high-permittivity dielectric materials has a permittivity of more than 100,000. 16 . The method of claim 10 , wherein at least one of the scavenger materials is a scavenger of electrons. 17 . The method of claim 10 , wherein at least one of the scavenger materials is a scavenger of holes. 18 . The method of claim 10 , wherein at least one of the scavenger materials is initially a liquid. 19 . The method of claim 10 , wherein at least one of the scavenger materials is initially a gas. 20 . The method of claim 10 , further comprising introducing pressure within the enclosed capacitor so that the pressure is higher than one bar.
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impregnated · CPC title
Liquid dielectrics · CPC title
Monocytes, macrophages · CPC title
Collagen; Gelatin · CPC title
Cells of the immune system · CPC title
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- What does patent US2026081073A1 cover?
- An apparatus and method of constructing high power density capacitors. The apparatus and method may include scavenging materials between and around high-permittivity dielectric sections. Scavenging materials are added to the capacitor to remove electrons or holes that can lead to breakdown, without substantially reducing capacitance.
- Who is the assignee on this patent?
- Weinberg Medical Physics Inc
- What technology area does this patent fall under?
- Primary CPC classification H01G4/06. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Mar 19 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).