Heat-curable resin composition and use thereof

Patent metadata

Field	Value
Publication number	US-2026042881-A1
Application number	US-202519285016-A
Country	US
Kind code	A1
Filing date	Jul 30, 2025
Priority date	Aug 8, 2024
Publication date	Feb 12, 2026
Grant date	—

Abstract

Provided is a heat-curable resin composition that not only has a low dielectric tangent but also is excellent in adhesivity, and that particularly results in a cured product which exhibits an excellent desmear resistance. The heat-curable resin composition includes (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000, (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000, (C) an epoxy resin having two or more epoxy groups in one molecule, (D) a curing agent for epoxy resin, (E) a curing catalyst, and (F) an inorganic filler, wherein the heat-curable resin composition contains the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.

First claim

What is claimed is:

1 . A heat-curable resin composition comprising the components (A) to (F) of:
(A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000; (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000; (C) an epoxy resin having two or more epoxy groups in one molecule; (D) a curing agent for epoxy resin; (E) a curing catalyst; and (F) an inorganic filler, wherein the heat-curable resin composition comprises the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.

2 . The heat-curable resin composition according to claim 1 , wherein the aromatic cyclic imide compound (A) comprises at least one selected from aromatic cyclic imides represented in the following by formulae (1) and (2) defined as

wherein, in the formula (1), P and Q are independently divalent groups represented by formulae defined as

wherein each X 1 is independently a divalent group selected from formulae defined as

and
wherein, in the formula (1), a is a number of 1 to 40 and each X represents a hydrogen atom or a methyl group; and

wherein, in the formula (2), each Q 1 independently is a divalent group represented by a formula defined as

wherein each X 2 is independently a divalent group selected from formulae defined as

and
wherein, in the formula (2), b is a number of 1 to 50, c is a number of 1 to 50, each X represents a hydrogen atom or a methyl group and each of A 1 and A 2 independently represents a divalent group selected from formulae (3) and (4) defined as

wherein, in the formulae (3) and (4), each X 3 is a divalent group selected from formula defined as

wherein, in the formula (3), each R 1 independently represents a hydrogen atom, a chlorine atom, or an aliphatic hydrocarbon group having 1 to 6 carbon atoms.

3 . The heat-curable resin composition according to claim 1 , wherein the aliphatic cyclic imide compound (B) is an aliphatic cyclic imide compound represented by a formula (5) defined as

wherein, in the formula (5), each A independently represents a tetravalent organic group having an aliphatic cyclic structure, each X represents a hydrogen atom or a methyl group, each W independently represents a divalent aliphatic hydrocarbon group, having 5 to 25 caron atoms, which optionally contains a heteroatom, and s is 0 to 10.

4 . The heat-curable resin composition according to claim 3 , wherein W in the formula (5) is a linear or branched alkylene group having 5 to 25 carbon atoms or a divalent aliphatic hydrocarbon group represented by any one of the structures defined as

wherein p 5 and p 6 are each a number of 0 to 4 and may be identical to or different from each other, each R 2 independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 20 carbon atoms, Z is an oxygen atom, a sulfur atom, or a methylene group, and wherein bonds in the above formulae that are yet unbonded to substituent groups are to be bonded to nitrogen atoms forming cyclic imide structures in the formula (5).

5 . The heat-curable resin composition according to claim 1 , wherein the aliphatic cyclic imide compound (B) is contained therein in an amount of 5 to 150 parts by mass based on 100 parts by mass of the aromatic cyclic imide compound (A).

6 . The heat-curable resin composition according to claim 1 , wherein the curing agent (D) for epoxy resin is an amine curing agent.

7 . A bonding film comprising the heat-curable resin composition according to claim 1 .

8 . A prepreg comprising a cured product of the heat-curable resin composition according to claim 1 .

9 . A resin-clad copper foil comprising a cured product of the heat-curable resin composition according to claim 1 .

10 . A build-up film comprising the heat-curable resin composition according to claim 1 .

11 . A printed-wiring board comprising the bonding film according to claim 7 .

12 . A printed-wiring board comprising the prepreg according to claim 8 .

13 . A printed-wiring board comprising the resin-clad copper foil according to claim 9 .

14 . A printed-wiring board comprising the build-up film according to claim 10 .

Assignees

• Shinetsu Chemical Co

Inventors

• Tsutsumi Yoshihiro
• Tsuura Atsushi
• Kudo Shunsuke
• Iguchi Hiroyuki
• Iwasaki Masayuki
• Kudo Yuki

Classifications

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• B32B15/08

  of synthetic resin · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title