Low dielectric resin composition, and resin film, prepreg, printed circuit board made thereby

Patent metadata

Field	Value
Publication number	US-9403981-B2
Application number	US-201514732121-A
Country	US
Kind code	B2
Filing date	Jun 5, 2015
Priority date	Jun 6, 2014
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

First claim

What is claimed is:

1. A resin composition, comprising:
(A) a polyimide resin;
(B) a pre-polymerised maleimide resin;
(C) a thermosetting resin; and
(D) a flame retardant,
wherein reactants for use in synthesizing the polyimide resin comprise an acid anhydride and diamines, with the diamines comprising a polyetherdiamine and at least one diamine selected from the group consisting of
4,4′-Diamino-3,3′,5,5′-tetraethyldiphenylmethane,
4,4′-Diamino-3,3′,5,5′-tetramethyldiphenylmethane,
4,4′-Diamino-3,3′-dimethyldiphenylmethane, and
4,4′-Diamino-3,3′-diethyldiphenylmethane.

2. The composition of claim 1 , wherein the acid anhydride comprises at least one element selected from the group consisting of pyromellitic dianhydride, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride, bisphenol-A diphthalic anhydride, and 4,4′-oxydiphthalic anhydride.

3. The composition of claim 1 , further comprising: (A) 100 parts by weight of a polyimide resin; (B) 10 to 50 parts by weight of a pre-polymerised maleimide resin; (C) 10 to 150 parts by weight of a thermosetting resin; and (D) 15 to 150 parts by weight of a flame retardant.

4. The composition of claim 1 , wherein reactants for use in synthesizing the polyimide resin further comprise an end-capping compound, and the end-capping compound comprises at least one element selected from the group consisting of 4-Aminophenol, phthalic acid anhydride, maleic anhydride, Nadic anhydride, p-toluidine, p-anisidine, and p-phenoxyaniline.

5. The composition of claim 1 , wherein reactants for use in synthesizing the pre-polymerised maleimide resin comprise a maleimide and a diamine.

6. The composition of claim 1 , wherein the thermosetting resin comprises at least one element selected from the group consisting of an epoxy resin, a cyanate ester resin, a polyphenylene ether resin, a polyester resin, and a phenoxy resin.

7. The composition of claim 1 , wherein the flame retardant is one of a phosphorus-containing flame retardant and a brominated flame retardant.

8. The composition of claim 1 , further comprising at least one element selected from the group consisting of an inorganic filler, a thermoplastic resin, a curing accelerator, a silane coupling agent, a toughening agent, and a solvent.

9. The composition of claim 1 , wherein the polyetherdiamine has two terminal primary amines whose polymer backbone comprises one of oxyethylene block, oxypropylene block, and a combination thereof.

10. The composition of claim 9 , wherein the polyetherdiamine has a number average molecular weight (Mn) of 100 to 5,000.

11. An article, made from the resin composition of claim 1 , which is a prepreg, a resin film, a resin coated copper, a laminate or a printed circuit board.

Assignees

• Elite Material Co Ltd

Inventors

• Hsieh Chen Yu

Classifications

• C08L79/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• H05K2201/012

  Flame-retardant; Preventing of inflammation · CPC title

• C08G73/1046

  Polyimides containing oxygen in the form of ether bonds in the main chain · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08G73/1042

  Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds · CPC title