Display apparatus having display module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2026011663-A1
Application number	US-202519259869-A
Country	US
Kind code	A1
Filing date	Jul 3, 2025
Priority date	Feb 3, 2022
Publication date	Jan 8, 2026
Grant date	—

Abstract

A display module includes: a substrate having a mounting surface, four side surfaces, and a rear surface opposite to the mounting surface, the substrate including a thin film transistor layer (TFT) provided on the mounting surface; a plurality of inorganic light-emitting diodes provided on the mounting surface of the substrate; a side wiring electrically connected to the TFT layer and extending along a first pair of side surfaces among the four side surfaces of the substrate; a front cover covering the TFT layer and the plurality of inorganic light emitting devices in a first direction; a metal plate provided on the rear surface of the substrate; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side of the side cover and grounded to the metal plate, wherein the side member is provided on a first side surface of the first pair of side surfaces along which the side wiring extends among the four side surfaces.

First claim

What is claimed is:

1 . A display module comprising:
a substrate having a mounting surface on which a plurality of inorganic light-emitting diodes are mounted and a TFT layer is formed, four side surfaces, and a rear surface being opposite to the mounting surface; a side wiring electrically connected to the TFT layer and extending along a first pair of side surfaces among the four side surfaces of the substrate; a front cover covering the TFT layer and the plurality of inorganic light emitting devices in a first direction; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side end of the side cover and disposed on a first side surface of the first pair of side surfaces along which the side wiring extends among the four side surfaces, wherein the side end of the side cover and a side end of the front cover on the side end of the side cover are aligned on a straight line in the first direction.

2 . The display module of claim 1 , further comprising a metal plate provided on the rear surface of the substrate, and
wherein the side member is configured to be grounded to the metal plate.

3 . The display module of claim 1 , wherein the side member comprises a first side member provided on the first side surface of the first pair of side surfaces along which the side wiring extends, and a second side member provided on a second side surface of a second pair of side surface along which the side wiring does not extend among the four side surfaces.

4 . The display module of claim 3 , wherein the first side member and the second side member are integrally formed as one body and extend along the first side surface and the second side surface.

5 . The display module of claim 1 , wherein a front end of the side member and a front end of the side cover in the first direction are disposed in a same line extending orthogonal to the first direction.

6 . A display apparatus comprising:
a plurality of display modules are arranged in an M*N matrix form; and a frame configured to support the plurality of display modules, wherein each display module of the plurality of display modules comprises: a substrate having a mounting surface on which a plurality of inorganic light-emitting diodes are mounted and a TFT layer is formed, four side surfaces, and a rear surface being opposite to the mounting surface; a side wiring electrically connected with the TFT layer and extending along a first pair of side surfaces among the four side surfaces; a front cover covering the plurality of inorganic light-emitting diodes and the TFT layer in a first direction; a metal plate provided on the rear surface; a side cover covering the side wiring and the four side surfaces; and a side member provided on a side end of the side cover and disposed on a first side surface of the first pair of side surfaces along which the side wiring extends among the four side surfaces, wherein the side end of the side cover and a side end of the front cover on the side end of the side cover are aligned on a straight line in the first direction.

7 . The display apparatus of claim 6 , wherein the plurality of display modules comprises a first display module and a second display module that is adjacent to the first display module in a direction in which the side wiring of the first display module is extends, and
wherein the side member of the first display module contacts a second side surface of the second display module among the first pair of side surfaces along which the side wiring of the second display module extends, and the side member of the second display module is not provided on the second side surface of the second display module.

8 . The display apparatus of claim 6 , wherein a first display module of the plurality of display modules is positioned such that a second side surface among the first pair of side surfaces along which the side wiring extends is adjacent to an edge of the frame, and the side member is not positioned on the second side surface, and
wherein the frame comprises a frame side member that surrounds the second side surface of the first display module among the first pair of side surfaces along which the side wiring extends.

9 . The display apparatus of claim 8 , wherein the frame side member extends along the edge of the frame.

10 . The display apparatus of claim 7 , wherein the side member is configured to be grounded to the metal plate.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Hong Soonmin
• Lee Tackmo
• Kim Gunwoo
• Shin Seonghwan

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/347

  Dispositions of multiple die-attach connectors · CPC title

• H10W72/344

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title