Resin, and arf dry photoresist composition comprising same and application
US-2024302749-A1 · Sep 12, 2024 · US
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing circuit board
US2025390018A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025390018-A1 |
| Application number | US-202418860120-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 4, 2024 |
| Priority date | Mar 17, 2023 |
| Publication date | Dec 25, 2025 |
| Grant date | — |
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- Title
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Abstract
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A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a dye, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.
First claim
Opening claim text (preview).
1 . A photosensitive resin composition comprising: a binder polymer; a photopolymerizable compound; a photopolymerization initiator; a dye; and a solvent, wherein the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent. 2 . The photosensitive resin composition according to claim 1 , wherein the ketone-based solvent having an alicyclic skeleton contains at least one selected from the group consisting of cyclopentanone and cyclohexanone. 3 . The photosensitive resin composition according to claim 1 , wherein the aromatic ether-based solvent contains anisole. 4 . The photosensitive resin composition according to claim 1 , wherein the solvent does not contain toluene. 5 . The photosensitive resin composition according to claim 1 , which is film-shaped. 6 . A photosensitive element comprising: a support; and a photosensitive layer formed using the photosensitive resin composition according to claim 1 on the support. 7 . A method for forming a resist pattern, the method comprising: a step of forming a photosensitive layer using the photosensitive resin composition according to claim 1 on a substrate; a step of photo-curing a part of the photosensitive layer; and a step of removing an uncured area of the photosensitive layer. 8 . A method for forming a resist pattern, the method comprising: a step of forming a photosensitive layer using the photosensitive element according to claim 6 on a substrate; a step of photo-curing a part of the photosensitive layer; and a step of removing an uncured area of the photosensitive layer. 9 . A method for producing a circuit board, the method comprising a step of subjecting a substrate on which a resist pattern is formed by the method for forming a resist pattern according to claim 7 to an etching or plating treatment to form a conductor pattern. 10 . A method for producing a circuit board, the method comprising a step of subjecting a substrate on which a resist pattern is formed by the method for forming a resist pattern according to claim 8 to an etching or plating treatment to form a conductor pattern.
Assignees
Inventors
Classifications
characterised by the composition of the mask · CPC title
using masks · CPC title
Photoresists · CPC title
Treatment after imagewise removal, e.g. baking · CPC title
- G03F7/0048Primary
characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents · CPC title
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Frequently asked questions
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- What does patent US2025390018A1 cover?
- A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a dye, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.
- Who is the assignee on this patent?
- Resonac Corp
- What technology area does this patent fall under?
- Primary CPC classification G03F7/0048. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Dec 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).