Multi-die systems with modular die-to-die link macros for enabling die-to-die communication

Patent metadata

Field	Value
Publication number	US-2025378039-A1
Application number	US-202418740224-A
Country	US
Kind code	A1
Filing date	Jun 11, 2024
Priority date	Jun 11, 2024
Publication date	Dec 11, 2025
Grant date	—

Abstract

Multi-die systems with modular die-to-die link macros for enabling die-to-die communication are described. A multi-die system includes a first die comprising a first set of modular die-to-die (D2D) transmit link macros and a first set of modular D2D receive link macros. The multi-die system further includes a second die, coupled to the first die via die-to-die (D2D) links, comprising a second set of modular D2D transmit link macros and a second set of modular D2D receive link macros. Each of the transmit/receive macros has the same physical shape, size, and the bandwidth capacity. The modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links and different amounts of edge depths for the first die and the second die along the die edge.

First claim

What is claimed:

1 . A multi-die system comprising:
a first die comprising: (1) a first set of modular die-to-die (D2D) transmit link macros, wherein each of the first set of modular D2D link transmit macros has a same physical shape, size, and a bandwidth capacity, and (2) a first set of modular D2D receive link macros, wherein each of the first set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros; and a second die, coupled to the first die via die-to-die (D2D) links, comprising: (1) a second set of modular D2D transmit link macros, wherein each of the second set of modular D2D link transmit macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros, and (2) a second set of modular D2D receive link macros, wherein each of the second set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros, wherein the first die has a die edge facing the second die, and wherein modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links across the die edge and different amounts of edge depths for the first die and the second die in a first direction parallel to the die edge.

2 . The multi-die system of claim 1 , wherein the different combinations of the amount of bandwidth for data being transmitted or received via the D2D links across the die edge includes a combination wherein a first amount of bandwidth for data being transmitted from the first die to the second die is greater than a second amount of bandwidth for data being received by the first die from the second die.

3 . The multi-die system of claim 1 , wherein the different combinations of the amount of bandwidth for data being transmitted or received via the D2D links across the die edge includes a combination wherein a first amount of bandwidth for data being received by the first die from the second die is greater than a second amount of bandwidth for data being transmitted by the first die to the second die.

4 . The multi-die system of claim 1 , wherein the modularity associated with each of the respective modular D2D transmit link macros and the respective modular D2D receive link macros enables different edge widths for the first die and the second die in a second direction perpendicular to the first direction.

5 . The multi-die system of claim 1 , wherein the modularity associated with each of the respective modular D2D transmit link macros and the respective modular D2D receive link macros: (1) enables ungrouping of data from two or more system-on-chip (SoC) channels for transmission from the first die, across the die edge, to the second die, and (2) enables grouping of data received from two or more SoC channels by the second die.

6 . The multi-die system of claim 1 , wherein each of the D2D links comprises a physical link between the first die and the second die, a physical link between the first die and an intermediate packaging structure, or a physical link between the intermediate packaging structure and the second die.

7 . The multi-die system of claim 6 , wherein the intermediate packaging structure comprises an interposer or an embedded multi-die interconnect bridge (EMIB).

8 . A multi-die system comprising:
a first die comprising a first set of die-to-die (D2D) nodes including a first set of clusters, wherein each of the first set of clusters comprises a first set of modular D2D transmit link macros and a first set of modular D2D receive link macros; and a second die, coupled to the first die via die-to-die (D2D) links, comprising a second set of die-to-die (D2D) nodes including a second set of clusters, wherein each of the second set of clusters comprises a second set of modular D2D transmit link macros and a second set of modular D2D receive link macros, wherein each of the first set of modular D2D link transmit macros, the first set of modular D2D receive link macros, the second set of modular D2D transmit link macros, and the second set of modular receive link macros has a same physical shape, size, and a bandwidth capacity, wherein the first die has a die edge facing the second die, and wherein modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links across the die edge and different amounts of edge depths for the first die and the second die in a first direction parallel to the die edge.

9 . The multi-die system of claim 8 , wherein the different combinations of the amount of bandwidth for data being transmitted or received via the D2D links across the die edge includes a combination wherein a first amount of bandwidth for data being transmitted from the first die to the second die is greater than a second amount of bandwidth for data being received by the first die from the second die.

10 . The multi-die system of claim 8 , wherein the different combinations of the amount of bandwidth for data being transmitted or received via the D2D links across the die edge includes a combination wherein a first amount of bandwidth for data being received by the first die from the second die is greater than a second amount of bandwidth for data being transmitted by the first die to the second die.

11 . The multi-die system of claim 8 , wherein the modularity associated with each of the first set of modular D2D transmit link macros and the first set of modular D2D receive link macros enables different edge widths for the first die in a second direction perpendicular to the first direction.

12 . The multi-die system of claim 8 , wherein the modularity associated with the second set of modular D2D receive link macros and the second set of modular D2D transmit link macros enables different edge widths for the second die in a second direction perpendicular to the first direction.

13 . The multi-die system of claim 8 , wherein each of the first set of clusters shares a first clock spine and wherein each of the second set of clusters shares a second clock spine.

14 . The multi-die system of claim 8 , wherein each of the D2D links comprises a physical link between the first die and the second die, a physical link between the first die and an intermediate packaging structure, or a physical link between the intermediate packaging structure and the second die.

15 . The multi-die system of claim 14 , wherein the intermediate packaging structure comprises an interposer or an embedded multi-die interconnect bridge (EMIB).

16 . A multi-die system including a first die coupled to a second die via die-to-die (D2D) links, wherein each of the D2D links is configured to carry serialized signals, wherein:
the first die comprising: (1) a first system-on-chip (SoC) channel having a first channel width, a second SoC channel having a second channel width, different from the first channel width, (2) a set of modular die-to-die (D2D) transmit link macros, wherein each of the set of modular D2D link transmit macros has a same physical shape, size, and a bandwidth capacity,
wherein data from the first SoC channel is ungrouped into a first group of data and a second group of data and data from the second SoC channel is ungrouped into a third gr

Assignees

• Microsoft Technology Licensing Llc

Inventors

• Boecker Charles Walter
• Liang Jin
• Trombley Michael Raymond
• Holland Jonathan
• Groen Eric Douglas
• Lu Ping
• Li Simon Shichi
• Tangirala Shankar Srinivasa
• Desai Shaishav A
• Vu Roxanne
• Shivnaraine Ravi

Classifications

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title