Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Semiconductor Device
US2025364471A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2025364471-A1 |
| Application number | US-202318873767-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 10, 2023 |
| Priority date | Jul 20, 2022 |
| Publication date | Nov 27, 2025 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor device includes an electronic component and a board that are disposed opposite to each other in a first direction, and a solder that connects the electronic component and the board, in which the electronic component includes a first electrode on a surface facing the board, the board includes a second electrode on a surface facing the electronic component, the solder has a bonding portion that is an intermetallic compound at an interface with each of the electronic component and the board, the solder contains Sn as a main component, and a variation in thickness of the bonding portion in the first direction is less than 2 micrometers.
First claim
Opening claim text (preview).
1 . A semiconductor device comprising: an electronic component and a board that are disposed opposite to each other in a first direction; and a solder that connects the electronic component and the board, wherein the electronic component includes a first electrode on a surface facing the board, the board includes a second electrode on a surface facing the electronic component, the solder has a bonding portion that is an intermetallic compound at an interface with each of the first electrode and the second electrode, the solder contains Sn as a main component, and a variation in thickness of the bonding portion in the first direction is less than 2 micrometers. 2 . The semiconductor device according to claim 1 , wherein the electronic component and the solder form a ball grid array package. 3 . A semiconductor device comprising: an electronic component and a board that are disposed opposite to each other in a first direction; and a solder that connects the electronic component and the board, wherein the electronic component includes a first electrode on a surface facing the board, the board includes a second electrode on a surface facing the electronic component, the solder has a bonding portion that is an intermetallic compound at an interface with each of the first electrode and the second electrode, the solder contains Sn as a main component, a variation in thickness of the bonding portion in the first direction is 2 micrometers or more, and a Bi content of the bonding portion is less than 3.0 wt %. 4 . The semiconductor device according to claim 3 , wherein the bonding portion has a Bi content of less than 3 .0 wt % and a Sb content of 3.0 wt % or more. 5 . A semiconductor device comprising: an electronic component and a board that are disposed opposite to each other in a first direction; and a solder that connects the electronic component and the board, wherein the electronic component includes a first electrode on a surface facing the board, the board includes a second electrode on a surface facing the electronic component, the solder has a bonding portion that is an intermetallic compound at an interface with each of the first electrode and the second electrode, the solder contains Sn as a main component, a variation in thickness of the bonding portion in the first direction is 2 micrometers or more, and the bonding portion does not contain Bi and has a Sb content of 3.0 wt% or more.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
changes in materials · CPC title
Soldering or alloying · CPC title
Intermetallic compounds · CPC title
forming coatings · CPC title
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Frequently asked questions
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- What does patent US2025364471A1 cover?
- A semiconductor device includes an electronic component and a board that are disposed opposite to each other in a first direction, and a solder that connects the electronic component and the board, in which the electronic component includes a first electrode on a surface facing the board, the board includes a second electrode on a surface facing the electronic component, the solder has a bondin…
- Who is the assignee on this patent?
- Hitachi Astemo Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W72/072. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 27 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).