Chemical mechanical polishing method using foamed slurry and apparatus for foamed slurry generation

Patent metadata

Field	Value
Publication number	US-2025360596-A1
Application number	US-202418669659-A
Country	US
Kind code	A1
Filing date	May 21, 2024
Priority date	May 21, 2024
Publication date	Nov 27, 2025
Grant date	—

Abstract

Embodiments of the present disclosure generally relate to dispensing slurry as a foam in chemical mechanical polishing systems. A polishing apparatus includes a platen, a polishing pad having a polishing surface and disposed on the platen, a carrier head configured to press a substrate onto the polishing surface, a spray bar assembly configured to dispense a polishing foam onto the polishing surface, and a controller coupled to the polishing apparatus and configured to cause the polishing apparatus to: place a substrate on the polishing surface using the carrier head, create a polishing foam using a polishing liquid, a surfactant, and a gas using the spray bar assembly, use the spray bar assembly to dispense the polishing foam onto the polishing pad, and rotate the polishing pad using the platen to polish the substrate.

First claim

What is claimed is:

1 . A polishing apparatus, comprising:
a platen; a polishing pad having a polishing surface and disposed on the platen; a carrier head configured to press a substrate onto the polishing surface; a spray bar assembly configured to dispense a polishing foam onto the polishing surface; and a controller coupled to the polishing apparatus and configured to cause the polishing apparatus to:
place a substrate on the polishing surface using the carrier head;
create a polishing foam using a polishing liquid, a surfactant, and a gas using the spray bar assembly;
use the spray bar assembly to dispense the polishing foam onto the polishing pad; and
rotate the polishing pad using the platen to polish the substrate.

2 . The polishing apparatus of claim 1 , wherein the spray bar assembly further comprises a polishing liquid supply line and a foam sprayer nozzle assembly coupled to the polishing liquid supply line, wherein the foam sprayer nozzle assembly comprises:
a nozzle body; a surfactant supply line coupled to the nozzle body; and a gas supply line coupled to the nozzle body.

3 . The polishing apparatus of claim 2 , wherein the polishing liquid, the surfactant, and the gas are configured to produce a polishing foam when mixed in an inner volume of the nozzle body.

4 . The polishing apparatus of claim 2 , wherein the gas supply line delivers nitrogen gas (N 2 ) to an inner volume of the nozzle body.

5 . The polishing apparatus of claim 1 , wherein the spray bar assembly further comprises a polishing mixture supply line and a foam sprayer nozzle assembly coupled to the polishing mixture supply line, wherein the foam sprayer nozzle assembly comprises:
a nozzle body; and a gas supply line coupled to the nozzle body.

6 . The polishing apparatus of claim 5 , wherein the polishing mixture supply line delivers a polishing mixture including a polishing liquid and a surfactant configured to create a foam when mixed with the gas delivered by the gas supply line in an inner volume of the nozzle body.

7 . The polishing apparatus of claim 5 , wherein the gas supply line delivers nitrogen gas (N 2 ) to an inner volume of the nozzle body.

8 . The polishing apparatus of claim 1 , further comprising a station cup wherein a de-foaming agent is injected to reduce the polishing foam to a liquid.

9 . A spray bar assembly, comprising:
a dispense arm; a polishing liquid supply line routed along the dispense arm; a surfactant supply line; a gas supply line; a foam sprayer nozzle assembly comprising a nozzle body and coupled to the polishing liquid supply line, the surfactant supply line, and the gas supply line, the foam sprayer nozzle assembly configured to dispense a polishing foam on a polishing pad; and a controller coupled to the spray bar assembly and configured to cause the spray bar assembly to:
create a polishing foam using a polishing liquid, a surfactant, and a gas using the foam sprayer nozzle assembly; and
dispense, using the dispense arm, the polishing foam onto a polishing pad.

10 . The spray bar assembly of claim 9 , wherein the polishing liquid, the surfactant, and the gas are configured to produce a polishing foam when mixed in an inner volume of the nozzle body.

11 . The spray bar assembly of claim 9 , wherein the gas supply line delivers nitrogen gas (N 2 ) to an inner volume of the nozzle body.

12 . The spray bar assembly of claim 9 , wherein the polishing liquid supply line delivers a polishing mixture of a polishing liquid and a surfactant before mixing with the gas and before entering an inner volume of the nozzle body.

13 . The spray bar assembly of claim 9 , wherein the polishing foam comprises bubbles of the gas with bubble walls having the polishing liquid and the surfactant.

14 . The spray bar assembly of claim 13 , the bubble walls further comprising abrasive particles.

15 . A method of polishing a substrate, comprising:
placing a substrate on a polishing pad of a polishing apparatus; creating a polishing foam using a polishing liquid, a surfactant, and a gas; dispensing the polishing foam onto the polishing pad; and rotating the polishing pad to polish the substrate.

16 . The method of claim 15 , wherein the polishing foam is created using a foam sprayer nozzle assembly comprising a nozzle body, a polishing liquid supply line, a surfactant supply line, and a gas supply line.

17 . The method of claim 16 , wherein a polishing liquid from the polishing liquid supply line, a surfactant from the surfactant supply line, and a gas from the gas supply line mix in an inner volume of the nozzle body to create the polishing foam.

18 . The method of claim 15 , wherein the polishing foam is created using a foam sprayer nozzle assembly comprising a nozzle body, a polishing mixture supply line configured to deliver a polishing mixture having a polishing liquid and a surfactant, and a gas supply line.

19 . The method of claim 18 , wherein a polishing mixture of the polishing mixture supply line and a gas of the gas supply line mix in an inner volume of the nozzle body to create the polishing foam.

20 . The method of claim 15 , wherein the gas is nitrogen gas (N 2 ).

Assignees

• Applied Materials Inc

Inventors

• Mikhaylichenko Ekaterina
• Brown Brian J

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/044

  characterised by the composition of the lapping agent · CPC title

• B24B57/02 Primary

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• H01L21/30625

  Electricity · mapped topic