Molded component

Patent metadata

Field	Value
Publication number	US-2025327830-A1
Application number	US-202318869922-A
Country	US
Kind code	A1
Filing date	May 17, 2023
Priority date	May 30, 2022
Publication date	Oct 23, 2025
Grant date	—

Abstract

A molded component 1 includes an internal component module including a first molded part, solder parts, and a second molded part. Lead wires include a first lead wire and a second lead wire. The first molded part includes a partition having a first face and a second face. The first lead wire has a first exposed section on the first face, and the second lead wire has a second exposed section on the second face. The first lead wire and the second lead wire are located at positions not overlapping with each other in a plan view from a direction in which the first face is oriented or a direction in which the second face is oriented. The solder parts include a first solder part located on the first face and a second solder part located on the second face.

First claim

1 . A molded component comprising:
an internal component module including:
at least one internal component including an electrical component body and a lead wire extending from the electrical component body; and
a first molded part covering a portion of the internal component;
an electrical conductor connected to the lead wire and connectable to another electrical component; a solder part connecting the lead wire to the electrical conductor; and a second molded part covering the internal component module, the electrical conductor, and the solder part, wherein the lead wire includes a first lead wire and a second lead wire, the first molded part includes a partition having a first face and a second face oriented in a direction opposite to a direction in which the first face is oriented, the first lead wire has a first exposed section exposed from the first molded part on the first face, the second lead wire has a second exposed section exposed from the first molded part on the second face, the first lead wire and the second lead wire are located at positions not overlapping with each other in a plan view from the direction in which the first face is oriented or the direction in which the second face is oriented, and the solder part includes:
a first solder part located on the first face and connecting the first exposed section to the electrical conductor; and
a second solder part located on the second face and connecting the second exposed section to the electrical conductor.

2 . The molded component according to claim 1 ,
wherein the internal component includes a first internal component and a second internal component, the first lead wire extends from the electrical component body included in the first internal component, and the second lead wire extends from the electrical component body included in the second internal component.

3 . The molded component according to claim 2 ,
wherein the first lead wire includes a plurality of first lead wires, the second lead wire includes a plurality of second lead wires, and the first molded part includes a first separation wall separating the first lead wires from each other, and a second separation wall separating the second lead wires from each other.

4 . The molded component according to claim 2 ,
wherein the first internal component and the second internal component are arranged in mirror symmetry with respect to a virtual plane passing through an intermediate position between the respective electrical component bodies and extending along an extension direction of the lead wires.

5 . The molded component according to claim 4 ,
wherein the first face is recessed from the second face in the direction in which the second face is oriented as viewed in a cross section perpendicular to the extension direction of the lead wires.

6 . The molded component according to claim 5 ,
wherein the first face is recessed from the second face by an amount corresponding to a thickness of each of the lead wires in the direction in which the second face is oriented as viewed in a cross section perpendicular to the extension direction of the lead wires.

7 . The molded component according to claim 5 ,
wherein the partition has a first step between the first face and a back side of the second face, and a second step between the second face and a back side of the first face, the first step has a corner having a chamfer shape, and the second step has a corner having a chamfer shape.

8 . The molded component according to claim 3 ,
wherein the first internal component and the second internal component are arranged in mirror symmetry with respect to a virtual plane passing through an intermediate position between the respective electrical component bodies and extending along an extension direction of the lead wires.

Assignees

• Sumitomo Wiring Systems

Inventors

• Wei Lin
• Koyano Hiroyuki
• Terasaka Yukitoshi
• Kobayashi Toshinari
• YAMAO Megumi

Classifications

• H10W76/12

  characterised by their shape · CPC title

• G01P1/026

  for speed measuring devices, e.g. pulse generator · CPC title

• G01P3/481 Primary

  of pulse signals · CPC title

• G01P1/02

  Housings · CPC title