Dry electrode and dry electrode manufacturing method

Patent metadata

Field	Value
Publication number	US-2025309276-A1
Application number	US-202418966298-A
Country	US
Kind code	A1
Filing date	Dec 3, 2024
Priority date	Mar 29, 2024
Publication date	Oct 2, 2025
Grant date	—

Abstract

A dry electrode includes a current collector including a surface having protrusions and depressions and a free-standing film including an active material, a conductive material, and a fiberized binder. The free-standing film is laminated directly onto the surface of the current collector having protrusions and depressions.

First claim

What is claimed is:

1 . A dry electrode comprising:
a current collector including a surface having protrusions and depressions; and a free-standing film including an active material, a conductive material, and a fiberized binder, the free-standing film being laminated directly onto the surface of the current collector having protrusions and depressions.

2 . The dry electrode as claimed in claim 1 , wherein the current collector includes:
a polymer layer; a primer layer positioned on a surface of the polymer layer; and a metal layer positioned on a surface of the primer layer and including the surface having protrusions and depressions.

3 . The dry electrode as claimed in claim 2 , wherein the metal layer is laminated on the primer layer.

4 . The dry electrode as claimed in claim 3 , wherein the surface of the current collector having protrusions and depressions is etched.

5 . The dry electrode as claimed in claim 2 , wherein the metal layer is deposited on the primer layer.

6 . The dry electrode as claimed in claim 5 , wherein the surface having protrusions and depressions is etched.

7 . The dry electrode as claimed in claim 2 , wherein the metal layer is formed by providing a seed on the surface of the primer layer and then electrolytically plating the seed.

8 . The dry electrode as claimed in claim 7 , wherein the surface having protrusions and depressions has a surface roughness that corresponds to the placement of the seed.

9 . The dry electrode as claimed in claim 2 , wherein the primer layer includes at least one of polymer and metal.

10 . The dry electrode as claimed in claim 1 , wherein the surface having protrusions and depressions has a surface roughness Ra from 0.1 μm to 20 μm.

11 . A method of manufacturing a dry electrode comprising:
forming a current collector surface having protrusions and depressions; and directly laminating a free-standing film including an active material, a conductive material, and a fiberized binder on the surface of the current collector that includes the protrusions and depressions.

12 . The method of manufacturing the dry electrode as claimed in claim 11 , wherein forming the current collector surface having protrusions and depressions includes:
forming a primer layer on a polymer layer surface; and forming a metal layer including the surface having protrusions and depressions on the primer layer surface.

13 . The method of manufacturing the dry electrode as claimed in claim 12 , wherein forming the metal layer including the surface having protrusions and depressions on the primer layer surface includes laminating the metal layer on the primer layer.

14 . The method of manufacturing the dry electrode as claimed in claim 13 , wherein forming the metal layer including the surface having protrusions and depressions on the primer layer surface further includes etching the metal layer to form the surface having protrusions and depressions.

15 . The method of manufacturing the dry electrode as claimed in claim 12 , wherein forming the metal layer including the surface having protrusions and depressions on the primer layer surface includes depositing the metal layer on the primer layer.

16 . The method of manufacturing the dry electrode as claimed in claim 15 , wherein forming the metal layer including the surface having protrusions and depressions on the primer layer surface further includes etching the metal layer to form the surface having protrusions and depressions.

17 . The method of manufacturing the dry electrode as claimed in claim 12 , wherein forming the metal layer including the surface having protrusions and depressions on the primer layer surface includes:
providing a seed on the surface of the primer layer; and electrolytically plating the seed on the surface of the primer layer to form the metal layer.

18 . The method of manufacturing the dry electrode as claimed in claim 17 , wherein the surface having protrusions and depressions has a surface roughness that corresponds to the arrangement of the seed.

19 . The method of manufacturing the dry electrode as claimed in claim 12 , wherein the primer layer includes at least one of a polymer and a metal.

20 . The method of manufacturing the dry electrode as claimed in claim 11 , wherein the surface having protrusions and depressions has a surface roughness Ra from 0.1 μm to 20 μm.

Assignees

• Samsung Sdi Co Ltd

Inventors

• Park Gwangwon
• Lee Seunghun
• Jung Daeun
• Moon Jeunggi
• Lee Jinhyon
• Choi Jongsup

Classifications

• H01M4/667 Primary

  in the form of layers, e.g. coatings · CPC title

• H01M4/70 Primary

  characterised by shape or form · CPC title

• H01M4/043

  involving compressing or compaction · CPC title

• H01M4/02 Primary

  Electrodes composed of, or comprising, active material · CPC title

• H01M4/13 Primary

  Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof · CPC title