Assembly for an optical system

Patent metadata

Field	Value
Publication number	US-2025271781-A1
Application number	US-202519205166-A
Country	US
Kind code	A1
Filing date	May 12, 2025
Priority date	Nov 18, 2022
Publication date	Aug 28, 2025
Grant date	—

Abstract

An assembly for an optical system having a mirror array having a plurality of mirror elements arranged on a first carrier. The first carrier contains control leads to the mirror elements. A first heat transport path can dissipate heat from the mirror array to a cooling mechanism during the operation of the optical system. At least one second heat transport path dissipates heat from the mirror array to a cooling mechanism during the operation of the optical system. The first heat transport path and the at least one second heat transport path are spatially separated from one another at least in regions. The first heat transport path extends via an interface component. The first heat transport path extends via the first carrier and the interface component from the mirror array to a cooling mechanism surrounding the interface component.

First claim

1 . An assembly, comprising:
a mirror array comprising a plurality of MEMS mirrors; a carrier supporting the mirror array; an interface component; a first cooling mechanism surrounding the interface component; and a second cooling mechanism, wherein:
the assembly comprises a first heat transport path which is configured to dissipate heat from the mirror array to the first cooling mechanism;
the first heat path comprises the first carrier and the interface component;
the assembly comprises a second heat transport path which is configured to dissipate heat from the mirror array to the second cooling mechanism;
the first and second heat transport paths are spatially separated from each other at least in regions; and
the first heat transport path is around an exterior of the second heat transport path.

2 . The assembly of claim 1 , wherein the first heat transport path dissipates heat in a first manner, and the second heat transport path dissipates heat in a second manner different from the first manner.

3 . The assembly of claim 1 , wherein the interface component comprises a material having a thermal conductivity of at least 10 Watts per meter-Kelvin.

4 . The assembly of claim 1 , wherein the second heat transport path comprises the interface component.

5 . The assembly of claim 1 , wherein the second heat transport path comprises the first carrier and the interface component.

6 . The assembly of claim 5 , wherein the interface component is directly secured to the second cooling mechanism.

7 . The assembly of claim 1 , further comprising a second carrier and a flexure, wherein the second carrier mechanically couples the first carrier and the interface component via the flexure.

8 . The assembly of claim 7 , wherein the second carrier comprises a material having a thermal conductivity of less than 40 Watts per meter-Kelvin.

9 . The assembly of claim 1 , wherein:
a first portion of the interface component faces the first carrier; a second portion of the interface component faces the second cooling mechanism; the second portion of the interface has a lower thermal conductivity than the first portion of the interface component; and the second portion of the interface is at least partially mechanically decoupled from the first portion of the interface component, and/or the second portion of the interface is at least partially thermally decoupled from the first portion of the interface component.

10 . The assembly of claim 1 , further comprising a decoupler that mechanically decouples the interface component from the second cooling mechanism.

11 . The assembly of claim 1 , wherein the second heat transport path comprises a heat pipe.

12 . The assembly of claim 11 , wherein a thermal resistance of the heat pipe is variably adjustable.

13 . The assembly of claim 11 , wherein the heat pipe is directly secured to the second cooling mechanism.

14 . The assembly of claim 1 , further comprising an electronic component, wherein the first heat transport path comprises the electronic component and/or the second heat transport path comprises the electronic component.

15 . The assembly of claim 1 , further comprising a common cooler, wherein the first and second heat transport paths comprise the common cooler.

16 . The assembly of claim 1 , wherein portions of the first and second cooling mechanisms that are separated from one each other are provided in the first heat transport path and in the second heat transport path.

17 . The assembly of claim 16 , wherein the assembly is configured so that cooling media of the first and second cooling mechanisms differ from each other.

18 . The assembly of claim 1 , further comprising a flexure designed comprising a decoupling geometry, wherein:
the assembly comprises a second carrier, and the flexure is between the first and second carriers; and/or the flexure is between the second carrier and the interface component.

19 . The assembly of claim 1 , wherein the assembly is configured to have a vacuum atmosphere in surroundings of the mirror array which is separated from a non-vacuum atmosphere in surroundings of the first and second cooling mechanisms.

20 . The assembly of claim 1 , wherein the MEMS mirrors are reflective for electromagnetic radiation at a wavelength of less than 30 nanometers.

21 . The assembly of claim 1 , wherein the support comprises control leads to the MEMS mirrors.

22 . An optical system, comprising:
an assembly according to claim 1 , wherein the optical system is a microlithographic projection exposure apparatus.

Assignees

• Zeiss Carl Smt Gmbh

Inventors

• Wolfsteiner Thomas
• Walz Stefan
• Holz Markus
• Bieg Hermann
• Grimm Andreas-Josef
• Frommeyer Andreas

Classifications

• G02B26/0833

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• G02B7/1815

  with cooling or heating systems (cooling arrangements for laser mirrors H01S3/0401) · CPC title

• G03F7/70841

  Constructional issues related to vacuum environment, e.g. load-lock chamber · CPC title

• G03F7/70825

  Mounting of individual elements, e.g. mounts, holders or supports (workpiece or mask holders G03F7/707) · CPC title

• G03F7/70116

  Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets · CPC title