Manufacturing method, substrate processing method, and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-2025132145-A1
Application number	US-202418901094-A
Country	US
Kind code	A1
Filing date	Sep 30, 2024
Priority date	Oct 18, 2023
Publication date	Apr 24, 2025
Grant date	—

Abstract

Disclosed is a manufacturing method including: a substrate loading operation of loading a substrate into a liquid treating chamber; a liquid treating operation of supplying a treatment solution to the substrate rotating in the liquid treating chamber through a nozzle; a substrate unloading operation of unloading the substrate from the liquid treating chamber, and a pressure control operation of changing a pressure of a space above the substrate at least one time in a period between the substrate loading operation and the substrate unloading operation.

First claim

1 . A manufacturing method comprising:
a substrate loading operation of loading a substrate into a liquid treating chamber; a liquid treating operation of supplying a treatment solution to the substrate rotating in the liquid treating chamber through a nozzle; a substrate unloading operation of unloading the substrate from the liquid treating chamber; and a pressure control operation of changing a pressure of a space above the substrate at least one time in a period between the substrate loading operation and the substrate unloading operation.

2 . The manufacturing method of claim 1 , wherein the pressure control operation includes changing the pressure of the space above the substrate to be lowered at least one time.

3 . The manufacturing method of claim 2 , further comprising:
a control releasing operation of increasing the pressure of the space above the substrate that was lowered in the pressure control operation.

4 . The manufacturing method of claim 3 , wherein the pressure control operation includes:
(a) reducing a supply rate per unit time of a downflow unit supplying downflow to the space above the substrate; (b) interrupting an operation of the downflow unit; or (c) increasing an exhaust volume per unit time of a treatment space in which the substrate is treated by the treatment solution to cause the pressure in the space above the substrate to be low.

5 . The manufacturing method of claim 4 , wherein the control releasing operation is performed after the pressure control operation and before the substrate unloading operation.

6 . The manufacturing method of claim 3 , wherein the pressure control operation includes disposing a blocking plate in the space above the substrate to block downflow supplied to the space above the substrate to cause the pressure in the space above the substrate to be lowered.

7 . The manufacturing method of claim 6 , wherein the control releasing operation is performed after the pressure control operation and before the substrate unloading operation.

8 . The manufacturing method of claim 6 , wherein the control releasing operation is performed after the pressure control operation and after the substrate unloading operation.

9 . The manufacturing method of claim 8 , wherein the blocking plate is disposed at a height equal to or higher than an entrance opening such that at least a portion of the downflow collides the blocking plate and is directed toward the entrance opening for the substrate provided in the liquid treating chamber.

10 . A substrate processing method comprising:
a liquid treating operation of supplying an organic solvent to a substrate rotating in a liquid treating chamber; a transfer operation of transferring the substrate on which the organic solvent is residual from the liquid treating chamber to a drying chamber; and a drying operation of supplying a supercritical fluid from the drying chamber to the substrate, and removing the organic solvent residual on the substrate, wherein a pressure control operation of reducing a pressure in a space above the substrate loaded into the liquid treating chamber at least one time during a period between loading of the substrate into the liquid treating chamber and unloading of the substrate from the liquid treating chamber.

11 . The substrate processing method of claim 10 , further comprising:
a control releasing operation of increasing a pressure of the space above the substrate that was lowered in the pressure control operation.

12 . The substrate processing method of claim 11 , wherein the pressure control operation is performed after the liquid treating operation,
the control releasing operation is performed after the substrate is unloaded from the liquid treating chamber, and the pressure control operation includes: (a) reducing a supply rate per unit time of a downflow unit supplying downflow to the space above the substrate; (b) interrupting an operation of the downflow unit; or (c) increasing an exhaust volume per unit time of a treatment space in which the substrate is treated by the treatment solution to cause the pressure in the space above the substrate to be lowered.

13 . The substrate processing method of claim 11 , wherein the control releasing operation is performed before the substrate is unloaded from the liquid treating chamber, and
the pressure control operation includes: (a) reducing a supply rate per unit time of a downflow unit supplying downflow to the space above the substrate; (b) interrupting an operation of the downflow unit; or (c) increasing an exhaust volume per unit time of a treatment space in which the substrate is treated by the treatment solution to cause the pressure in the space above the substrate to be lowered.

14 . The substrate processing method of claim 11 , wherein the control releasing operation is performed before or after the substrate is unloaded from the liquid treating chamber, and
the pressure control operation includes disposing a blocking plate in the space above the substrate to block downflow supplied to the space above the substrate to cause the pressure in the space above the substrate to be lowered.

15 . The substrate processing method of claim 10 , wherein the organic solvent is isopropyl alcohol.

16 .- 20 . (canceled)

Assignees

• Semes Co Ltd

Inventors

• Yoon Do Hyeon
• Park Mi So
• Im Yong Joon
• Gwon Hye Bin

Classifications

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0408

  for drying · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title